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Thermal-bubble angular accelerometer

A technology of hot air bubbles and accelerometers, applied in the direction of measuring acceleration, instruments, speed/acceleration/impact measurement, etc., can solve the problems of limiting the service life of micro-electromechanical gyroscopes, easy fatigue aging, etc., and achieve long life and low production steps Simple, unbreakable effects

Inactive Publication Date: 2015-07-22
CHUNG HUA UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the movable comb structure is prone to fatigue and aging, so it will limit the lifespan of the MEMS gyroscope

Method used

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  • Thermal-bubble angular accelerometer
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  • Thermal-bubble angular accelerometer

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Embodiment Construction

[0090] In some embodiments, a thermal bubble angular accelerometer includes at least one heater and a plurality of temperature sensing elements, wherein the at least one heater and the plurality of temperature sensing elements are not suspended, so the thermal bubble of the present invention Angular accelerometer, easy to manufacture and not easy to damage.

[0091] In some embodiments, a thermal bubble angular accelerometer includes a plurality of temperature sensing elements and a packaging cover, the packaging cover only covers the parts of the plurality of temperature sensing elements, so that the exposure of the plurality of temperature sensing elements The part can be located at room temperature, so more accurate temperature calibration and measurement values ​​can be obtained.

[0092] figure 1 A schematic diagram of an angular acceleration measurement system 1 according to an embodiment of the present invention is shown. refer to figure 1 As shown, the angular accel...

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Abstract

The invention discloses a thermal-bubble angular accelerometer which comprises a heat-insulating substrate and an angular acceleration sensing device. The angular acceleration sensing device is arranged on the heat-insulating substrate, is used for measuring angular acceleration of rotation around a rotary shaft, and comprises a temperature sensing element group. The temperature sensing element group comprises two temperature sensing elements and a heater arranged between the temperature sensing elements. The distance between two ends, close to the rotary shaft, of the temperature sensing elements is larger than that between two ends, away from the rotary shaft, of the temperature sensing elements.

Description

technical field [0001] The present invention relates to an angular accelerometer, in particular to a thermal bubble angular accelerometer. Background technique [0002] US Patent No. 6,182,509 discloses a Thermal Bubble Accelerometer. The hot-bubble accelerometer includes an insulating substrate, a heater and two temperature sensing elements. The thermal insulation base plate has a groove, the heater and the two temperature sensing elements are suspended on the groove, and the two temperature sensing elements are placed equidistantly on opposite sides of the heater respectively. [0003] To form the suspended heater and two temperature sensing elements, a silicon dioxide layer is first formed on an insulating substrate. Then, a polysilicon layer is formed on the silicon dioxide layer. Afterwards, an oxidation process is performed to form another oxide layer on the polysilicon layer. Next, the polysilicon layer is patterned to obtain three polysilicon bridges. Then, an o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/00
Inventor 林君明
Owner CHUNG HUA UNIVERSITY