A Prediction Method of Tensile Strength of Composite π-shaped Bonded Connection Structure Based on Average Failure Index

A composite material and connection structure technology, applied in the direction of electrical digital data processing, special data processing applications, instruments, etc., can solve the problems of large calculation scale and long calculation cycle, so as to reduce test cost, save calculation cost and time, shorten The effect of development cycle
CN103559390BActive Publication Date: 2017-01-04BEIHANG UNIV

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIHANG UNIV
Publication Date
2017-01-04

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Abstract

The invention relates to a composite material Pi-shaped gluing connection structure tensile strength prediction method based on an average invalidation index. The method includes the following steps: (1) a Pi connector geometrical model is built according to geometrical parameters of a composite material Pi-shaped gluing connection structure; (2) determining tensile load and boundary condition of the composite material Pi-shaped connector geometrical model according to the stress condition of the integrated composite material structure; (3) acquiring an accurate Pi connector three-dimensional finite element model through grid encryption based on the Pi connector geometrical model, meanwhile ensuring that grids on key connection faces L, U and B are even and calculating stress distribution of the three-dimensional finite element model under tensile load; (4) extracting positive axis stress component value of nodes on the Pi connector key connection faces L, U and B and calculating the invalidation index Rij on the key connection face; (5) respectively calculating the average invalidation indexes based on the key connection faces L, U and B of the Pi connector; (6) conducting calculation according to the tensile load P0 and the maximum value of the average invalidation indexes to obtain the invalidation strength value P of the obtained connector. The method is applicable to engineering application, can remarkably shorten the developing period of the Pi connector and reduces test cost.
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Description

technical field

[0001] The invention relates to the tensile strength prediction of a typical π-shaped adhesive connection structure in an integrated composite material structure, and is suitable for a typical π-shaped adhesive connection structure of composite materials widely used in aerospace vehicles. Background technique

[0002] The application technology of lightweight, high-efficiency, and low-cost composite material structures is the key technology for the design and manufacture of aircraft composite material structures that aviation developed countries have invested heavily in research in recent years. An important way to realize lightweight, high-efficiency, and low-cost composite structures is the integration of structures. The integrated structural form can greatly reduce various fasteners and corresponding connection and assembly work, improve the weight reduction efficiency of the structure, and greatly reduce the manufacturing cost. At the same time, the inte...

Claims

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