Substrate embedded type module structure
A module structure, technology in the substrate, applied in the direction of radiation control devices, etc., can solve the problems of huge expenses, difficult control, low yield, etc.
Active Publication Date: 2014-02-12
LITE ON ELECTRONICS (GUANGZHOU) LTD +1
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Problems solved by technology
[0006] In the current flip-chip packaging structure, although the height of the module structure can be reduced, the equipment for flip-chip packaging is too expensive and its mass production speed (Unit Per Hour) is too slow
Therefore, its investment requires huge funds, and the yield rate is low and difficult to control
Method used
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[0048] The present invention is described in detail below with matching embodiments and accompanying drawings. It should be understood that all the embodiments in the present invention are for illustration only, not for limitation. Therefore, in addition to the embodiments herein, the present invention can also be widely applied in other embodiments. And the present invention is not limited to any embodiment, but should be determined by the appended claims and their equivalent fields.
[0049] The invention provides a substrate-embedded module structure, which can be completed by chip-on-board (COB) manufacturing process. Chip direct packaging is a way of integrated circuit packaging, which is to directly adhere the chip to the circuit board or substrate, which can effectively transfer the chip packaging and testing steps to the circuit board assembly.
[0050] figure 1 A cross-sectional view showing the flip-chip package structure. Such as figure 1 As shown, the flip chi...
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The invention discloses a substrate embedded type module structure comprising a first substrate, a chip, a second substrate and a lens frame. The first substrate is provided with a groove structure. The chip is arranged in the groove structure of the first substrate and provided with a first contact pad and a sensing area. The second substrate is arranged on the first substrate and provided with at least one perforating structure and a second contact pad. The first contact pad is electrically connected with the second contact pad via a welding wire. The second substrate comprises a first part which is embedded into the module structure and a second part which extends to an external side of the module structure. The perforating structure and the second contact pad are formed in the first part. The lens frame is arranged on the second substrate. A lens is arranged above the lens frame. A transparent substrate is arranged inside the lens frame or on the second substrate, and the lens is arranged in alignment with the transparent substrate and the sensing area.
Description
technical field [0001] The invention relates to a semiconductor component module structure, in particular to a substrate-embedded module structure integrating a substrate, a lens frame and an image sensor to reduce component size. Background technique [0002] With the rapid development of semiconductor technology, in the traditional flip-chip structure, the array of solder balls is formed on the surface of the grain, and the desired pattern is formed through the traditional solder paste through the solder ball mask. Packaging functions include heat dissipation, signal transmission, power distribution, protection, etc. When chips become more complex, traditional packaging such as lead frame packaging, flexible packaging, and rigid packaging cannot meet the needs of high-density and small-size chips. Wafer level packaging technology is an advanced packaging technology whereby dies are fabricated and tested on a wafer and then separated by dicing for assembly in a surface moun...
Claims
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IPC IPC(8): H01L27/146
Inventor 詹欣达
Owner LITE ON ELECTRONICS (GUANGZHOU) LTD