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Modular structure of window-type image sensing chip

A technology of image sensing and module structure, applied to radiation control devices, etc., can solve the problems of difficult control, low yield, huge cost, etc.

Active Publication Date: 2014-03-12
LITE ON ELECTRONICS (GUANGZHOU) LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the current flip-chip packaging structure, although the height of the module structure can be reduced, the equipment for flip-chip packaging is too expensive and its mass production speed (Unit Per Hour) is too slow
Therefore, its investment requires huge funds, and the yield rate is low and difficult to control

Method used

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  • Modular structure of window-type image sensing chip
  • Modular structure of window-type image sensing chip
  • Modular structure of window-type image sensing chip

Examples

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Embodiment Construction

[0033] The present invention will be described in detail below with examples and accompanying drawings. It should be understood that all the embodiments in the present invention are for illustration only, not for limitation. Therefore, the present invention can also be widely applied in other embodiments except the embodiments herein. And the present invention is not limited to any embodiment, but should be determined by the appended claims and their equivalents.

[0034] The invention provides a module structure of a window-type image sensing chip, which can be completed by chip-on-board (COB) manufacturing process. Chip direct packaging is a way of integrated circuit packaging, which is to directly adhere the chip to the circuit board or substrate, which can effectively transfer the chip packaging and testing steps to the circuit board assembly.

[0035] figure 1 It is a cross-sectional view of the flip-chip package structure. As shown in FIG. 1 , the flip chip package s...

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Abstract

The invention discloses a modular structure of a window-type image sensor chip, the modular structure comprising a first substrate; a chip disposed on the first substrate and provided with a first contact pad and a sensing region; a second substrate disposed on the first substrate and provided with a perforated structure and a second contact pad, wherein the chip is disposed in the perforated structure and the first contact pad is electrically connected to the second contact pad through a welding wire; and a lens holder configured on the second substrate, with a lens located above the lens holder and a transparent substrate disposed on the lens holder or the second substrate, wherein the lens is directed to the transparent substrate and the sensing region.

Description

technical field [0001] The invention relates to a semiconductor assembly structure, in particular to a module structure of a window-type image sensing chip which integrates a lens frame and an image sensor to reduce the size of the assembly. Background technique [0002] With the rapid development of semiconductor technology, in the traditional flip-chip structure, the array of solder balls is formed on the surface of the grain, and the desired pattern is formed through the traditional solder paste and solder ball mask. Packaging functions include heat dissipation, signal transmission, power distribution, protection, etc. When chips become more complex, traditional packaging such as lead frame packaging, flexible packaging, and rigid packaging cannot meet the needs of high-density and small-size chips. Wafer level packaging technology is an advanced packaging technology whereby dies are fabricated and tested on a wafer and then separated by dicing for assembly in a surface m...

Claims

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Application Information

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IPC IPC(8): H01L27/146
Inventor 詹欣达
Owner LITE ON ELECTRONICS (GUANGZHOU) LTD