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Substrate-connected module structure

A modular structure and connection technology, applied in the field of substrate connection module structure, can solve the problems of huge cost, difficult control, low yield rate, etc.

Active Publication Date: 2016-11-16
LITE ON ELECTRONICS (GUANGZHOU) LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the current flip-chip packaging structure, although the height of the module structure can be reduced, the equipment for flip-chip packaging is too expensive and its mass production speed (Unit Per Hour) is too slow
Therefore, its investment requires huge funds, and the yield rate is low and difficult to control

Method used

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  • Substrate-connected module structure
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Embodiment Construction

[0030] The present invention will be described in detail below with examples and accompanying drawings. It should be understood that all the embodiments in the present invention are for illustration only, not for limitation. Therefore, the present invention can also be widely applied in other embodiments except the embodiments herein. And the present invention is not limited to any embodiment, but should be determined by the appended claims and their equivalents.

[0031] figure 1 A cross-sectional view showing the flip-chip package structure. Such as figure 1 As shown, the flip chip package structure 100 includes a substrate 106 , a chip 105 , a passive component 107 , a lens holder 104 , a lens 101 and a transparent substrate 102 . The substrate 106 has a groove structure formed therein to receive the chip 105 and the conductive layer 108 . The chip 105 and the conductive layer 108 are formed under the substrate 106 , wherein the conductive layer 108 is electrically con...

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Abstract

The invention discloses a substrate connection type module structure comprising a substrate, a chip, and a lens frame. The substrate is provided with a perforating structure and a first contact pad. The chip is arranged inside the perforating structure of the substrate and provided with a second contact pad and a sending area. The first contact pad is electrically connected with the second contact pad via a welding wire. The substrate and the chip are arranged on a same layer. The lens frame is arranged on the substrate. A lens is arranged above the lens frame. A transparent substrate is arranged on the lens frame. The lens is arranged in alignment with the transparent substrate and the sensing area.

Description

technical field [0001] The invention relates to a module structure for semiconductor components, in particular to a substrate-connected module structure that integrates a substrate, a lens frame and an image sensor to reduce component size. Background technique [0002] With the rapid development of semiconductor technology, in the traditional flip-chip structure, the array of solder balls is formed on the surface of the grain, and the desired pattern is formed through the traditional solder paste and solder ball mask. Packaging functions include heat dissipation, signal transmission, power distribution, protection, etc. When chips become more complex, traditional packaging such as lead frame packaging, flexible packaging, and rigid packaging cannot meet the needs of high-density and small-size chips. Wafer level packaging technology is an advanced packaging technology whereby dies are fabricated and tested on a wafer and then separated by dicing for assembly in a surface mo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146
Inventor 詹欣达
Owner LITE ON ELECTRONICS (GUANGZHOU) LTD