Solder wire end sealing device
A sealing device and solder wire technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of high labor intensity, difficult to grasp the clamping force, poor sealing, etc., and achieve low labor intensity. , High production efficiency, good sealing effect
Active Publication Date: 2014-04-09
中山翰华锡业有限公司
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Problems solved by technology
The existing sealing method is to manually clamp the port with pliers, so that the solder wire is deformed to seal the port. The labor intensity is high, and the clamping force is difficult to grasp. If the force is too large, the solder wire will be easily broken, and if the force is too small, the seal will not be good. it is good
Method used
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[0021] A solder wire end sealing device, used for sealing the solder wire end filled with flux inside, it includes a base 1, a cylinder block 2 is arranged on the base 1, and a Cylinder cavity 201, described cylinder cavity 201 is equipped with described cylinder cavity 201 and is divided into the piston 3 of front cylinder cavity 211 and rear cylinder cavity 212, and described piston 3 two ends are respectively connected with front piston rod 301 and rear Piston rod 302, the base 1 is provided with a sealing fixed mold 4, and the front end of the front piston rod 301 is provided with a sealing movable mold 5 that cooperates with the sealing fixed mold 4 to extrude the solder wire to seal. The front end of the sealing movable mold 5 is provided with a mold tooth 501, and the described cylinder cavity 201 is connected with a pedal pneumatic power device 6, and the described pedal pneumatic power device 6 includes a pedal seat 601, on which the pedal seat 601 A pedal 602 is hing...
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The invention discloses a solder wire end sealing device. The solder wire end sealing device comprises a base. An air cylinder body is arranged on the base. An air cylinder cavity is formed in the air cylinder body. A piston is arranged in the air cylinder cavity and the air cylinder cavity is divided into a front air cylinder cavity and a rear air cylinder cavity by the piston. The two ends of the piston are connected with a front piston rod and a rear piston rod respectively. A fixed sealing die is arranged on the base. A movable sealing die is arranged at the front end of the front piston rod and the movable sealing die and the fixed sealing die are matched with each other to squeeze and seal a solder wire. Die teeth are arranged at the front end of the movable sealing die. A stepping inflation power device is connected to the air cylinder cavity. The stepping inflation power device comprises a pedal base. A pedal is hinged to the pedal base. An inflation cylinder body is arranged on the pedal base. An inflation cavity is formed in the inflation cylinder body. An inflation piston which slides due to pushing by the pedal is arranged in the inflation cavity. The inflation cavity is divided into a front inflation cavity and a rear inflation cavity by the inflation piston. The front inflation cavity is communicated with the rear inflation cavity. The rear inflation cavity is communicated with the front air inflation cavity. A resetting spring is arranged between the pedal and the pedal base.
Description
【Technical field】 [0001] The invention relates to a solder wire processing equipment, more specifically to a solder wire sealing device. 【Background technique】 [0002] There is a longitudinal through hole in the middle of the solder wire, and the through hole is filled with liquid flux. After the solder wire is cut, the flux will flow out, resulting in poor welding effect of the solder wire and affecting the cleaning of the package. The solder wire ends need to be sealed. The existing sealing method is to manually clamp the port with pliers, so that the solder wire is deformed to seal the port. The labor intensity is high, and the clamping force is difficult to grasp. If the force is too large, the solder wire will be easily broken, and if the force is too small, the seal will not be good. it is good. 【Content of invention】 [0003] The object of the present invention is to overcome the shortcomings of the prior art, and provide a solder wire end sealing device with goo...
Claims
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Login to View More IPC IPC(8): B23K35/40
CPCB23K35/406
Inventor 魏河苏秋华李珊蓝佳席汪亮张春慧吴金珍梁小伟
Owner 中山翰华锡业有限公司