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Impedance matching method and device of transmission line with via hole

An impedance matching and transmission line technology, applied in the field of communication, can solve the problems of impedance mismatch of transmission line and increase of PCB manufacturing cost.

Active Publication Date: 2014-04-16
LOONGSON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention provides a method and device for impedance matching of a transmission line with a via, which is used to solve the problem in the prior art that the diameter of the via hole is reduced to increase the manufacturing cost of the PCB in order to meet the requirements of impedance matching for the transmission line; In addition, it solves the problem of impedance mismatch of the transmission line caused when the diameter of some vias on the PCB cannot be modified.

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  • Impedance matching method and device of transmission line with via hole
  • Impedance matching method and device of transmission line with via hole
  • Impedance matching method and device of transmission line with via hole

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Embodiment Construction

[0032] For the wiring layout of the transmission lines on the PCB and the corresponding components, developers generally implement the corresponding wiring layout software. In the process of wiring layout, it is necessary to ensure that the characteristic impedance of the transmission line meets the requirements of impedance matching, and the characteristic impedance of the transmission line is inseparable from the line width of the transmission line. Therefore, developers are required to simulate the characteristic impedance of the transmission line. When the characteristic impedance of the transmission line does not meet the impedance matching requirements, the line width of the transmission line needs to be passed to achieve impedance matching.

[0033] figure 1 This is a schematic flowchart of Embodiment 1 of a method for impedance matching of a transmission line with vias provided by the present invention, and the execution body of the method may be a computer. Such as figur...

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Abstract

The invention provides an impedance matching method and device of a transmission line with a via hole. The impedance matching method comprises the steps that whether first characteristic impedance of the transmission line meets the requirements of impedance matching is judged, and a judgment result is obtained; if the judgment result is that the first characteristic impedance of the transmission line does not meet the requirements of impedance matching, the width of a first transmission line in the transmission line is regulated; the first transmission line treats the via hole as the starting point and extends in the direction, far away from the via hole, of the transmission line, and the length of the first transmission line is preset; second characteristic impedance of the transmission line with the width regulated is obtained; the second characteristic impedance serves as the new first characteristic impedance and is judged until the judgment result is that the first characteristic impedance of the transmission line meets the requirements of impedance matching. According to the technical scheme, the manufacturing cost of a PCB is lowered; on the other hand, when the diameter of some via holes in the PCB can not be changed, the impedance of the transmission line can meet the requirements of impedance matching by means of the technical scheme.

Description

Technical field [0001] The present invention relates to the field of communication technology, and in particular to a method and device for impedance matching of a transmission line with via holes. Background technique [0002] Impedance matching is mainly used on transmission lines. Its purpose is to enable all high-frequency microwave signals to be transmitted from the source to the load without signal reflection back, thereby improving energy efficiency. Specifically, during signal transmission, the load impedance is required to be equal to the characteristic impedance of the transmission line. At this time, the signal transmission will not produce reflection, which means that all energy is absorbed by the load; otherwise, there is energy loss in the transmission. In order to prevent signal reflection during printed circuit board (Printed Circuit Board, hereinafter referred to as PCB) wiring, the line impedance of the transmission line is required to reach a matching value, so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 蒋喜良韩文汉张戈刘奇
Owner LOONGSON TECH CORP