Unlock instant, AI-driven research and patent intelligence for your innovation.

Method and device for impedance matching of transmission lines with vias

A technology of impedance matching and transmission lines, applied in the field of communication, can solve problems such as increased PCB production costs and mismatched transmission line impedances

Active Publication Date: 2017-02-15
LOONGSON TECH CORP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention provides a method and device for impedance matching of a transmission line with a via, which is used to solve the problem in the prior art that the diameter of the via hole is reduced to increase the manufacturing cost of the PCB in order to meet the requirements of impedance matching for the transmission line; In addition, it solves the problem of impedance mismatch of the transmission line caused when the diameter of some vias on the PCB cannot be modified.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for impedance matching of transmission lines with vias
  • Method and device for impedance matching of transmission lines with vias
  • Method and device for impedance matching of transmission lines with vias

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] For the wiring layout of the transmission line on the PCB and the corresponding components, the developer usually implements it through the corresponding wiring layout software. In the process of wiring layout, it is necessary to ensure that the characteristic impedance of the transmission line meets the requirements of impedance matching, and the characteristic impedance of the transmission line is closely related to the line width of the transmission line. Therefore, developers need to simulate the characteristic impedance of the transmission line. When the characteristic impedance of the transmission line does not meet the impedance matching requirements, it is necessary to pass the line width of the transmission line to achieve impedance matching.

[0033] figure 1 It is a schematic flow chart of Embodiment 1 of the method for impedance matching of a transmission line with vias provided by the present invention, and the execution body of the method may be a computer...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an impedance matching method and device of a transmission line with a via hole. The impedance matching method comprises the steps that whether first characteristic impedance of the transmission line meets the requirements of impedance matching is judged, and a judgment result is obtained; if the judgment result is that the first characteristic impedance of the transmission line does not meet the requirements of impedance matching, the width of a first transmission line in the transmission line is regulated; the first transmission line treats the via hole as the starting point and extends in the direction, far away from the via hole, of the transmission line, and the length of the first transmission line is preset; second characteristic impedance of the transmission line with the width regulated is obtained; the second characteristic impedance serves as the new first characteristic impedance and is judged until the judgment result is that the first characteristic impedance of the transmission line meets the requirements of impedance matching. According to the technical scheme, the manufacturing cost of a PCB is lowered; on the other hand, when the diameter of some via holes in the PCB can not be changed, the impedance of the transmission line can meet the requirements of impedance matching by means of the technical scheme.

Description

technical field [0001] The invention relates to the field of communication technology, in particular to a method and device for impedance matching of a transmission line with vias. Background technique [0002] Impedance matching is mainly used on transmission lines, and its purpose is to enable all high-frequency microwave signals to be transmitted from the source point to the load end without signal reflection back, thereby improving energy efficiency. Specifically, it means that when the signal is transmitted, the load impedance is required to be equal to the characteristic impedance of the transmission line. At this time, the signal transmission will not produce reflection, which means that all energy is absorbed by the load; otherwise, there will be energy loss during transmission. When wiring a printed circuit board (hereinafter referred to as PCB), in order to prevent signal reflection, the line impedance of the transmission line is required to reach a matching value,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 蒋喜良韩文汉张戈刘奇
Owner LOONGSON TECH CORP