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ESD (Electronic Static Discharge) protection structure and method

A protective structure and structural layer technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of reducing device performance and yield, instantaneously moving large current and electrostatic discharge, damaging device structure, etc., to improve performance and yield , The effect of reducing the probability of electrostatic damage

Inactive Publication Date: 2014-05-21
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned problems, the present invention provides an ESD protection structure and method to overcome the remaining carriers such as electrons or holes (holes) in the prepared structural devices when performing the array process of the panel in the prior art. ), and a large number of residual carriers of the same type will cause serious electrostatic phenomena, and the residual large number of carriers will move instantaneously when encountering a discharge inducer, causing large currents and electrostatic discharges, and then Severe damage to the device structure, especially the circuit structure in the panel may even be broken down to cause short circuit and / or open circuit of the device, which greatly reduces the performance and yield of the device

Method used

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  • ESD (Electronic Static Discharge) protection structure and method
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Embodiment Construction

[0055] The present invention will be further described below based on specific embodiments and drawings, but it is not intended as a limitation of the present invention.

[0056] figure 1 It is a structural schematic diagram of an embodiment in an ESD protection structure of the present invention; figure 2 Yes figure 1 Schematic diagram of the structure of the semiconductor substrate shown; image 3 Yes figure 1 Schematic diagram of the partial structure of the electrostatic discharge structure shown.

[0057] like Figure 1~3 As shown, an ESD protection structure of the present application is applied to reduce the probability of electrostatic damage (ESD attack) in panel design (panel design), and the ESD protection structure includes a semiconductor substrate 1 having an empty area 11 and a device area 12 ( Such as glass substrates, etc.), the above-mentioned empty area 11 is an area where no device graphics will be formed during the manufacturing process of the displa...

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Abstract

The invention relates to the field of the structure of a display device and manufacturing thereof, in particular to an ESD (Electronic Static Discharge) protection structure and method. In a device manufacturing process, an electrostatic discharge structure is manufactured in an open region during manufacturing of a structural layer having a current conducting property in a device region, and carriers remaining in the device region are discharged circularly to discharge carriers remaining in the device region once in the manufacturing process of each structural layer having the current conducting property in order to prevent the carriers in the device region from being accumulated on a large scale, thereby avoiding the formation of excessive momentary current, effectively lowering the probability of an electrostatic damage phenomenon in the device structure, and improving the performance and yield of a product.

Description

technical field [0001] The invention relates to the structure and preparation field of a display device, in particular to a panel design ESD protection structure and method. Background technique [0002] In the array (Array) process of display devices (such as AMOOLED, etc.), due to the remaining carriers (holes or electrons) in the prepared device structure with conductive properties, and then gather to form static electricity, especially the preparation of the metal layer During the process, redundant carriers are generated in the structural layer that is very easy to prepare, and when the same carriers (that is, both electrons or holes) remain between the interconnected metal layers, the redundant carriers Carriers converge and form a strong electrostatic phenomenon. When encountering a suitable release path, a large number of carriers will be transferred or discharged instantaneously (Electronic Static Discharge, ESD for short), which will cause damage to the internal ci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/02H01L21/82
Inventor 蔡学明
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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