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Circuit board and its manufacturing method and optoelectronic device with the circuit board

A manufacturing method and circuit board technology are applied in multilayer circuit manufacturing, optical waveguide coupling, printed circuit components, etc., which can solve problems such as optical signal loss, affecting device performance, and large surface roughness of the optical waveguide layer. The effect of reducing strength loss

Inactive Publication Date: 2017-10-27
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, forming openings by laser cutting or mechanical drilling often results in considerable surface roughness on the sidewalls of the optical waveguide layer
In this way, when the optical signal enters the optical waveguide layer from the light input end and leaves the optical waveguide layer from the light output end, the optical signal will be greatly lost, thereby affecting the performance of the device

Method used

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  • Circuit board and its manufacturing method and optoelectronic device with the circuit board
  • Circuit board and its manufacturing method and optoelectronic device with the circuit board
  • Circuit board and its manufacturing method and optoelectronic device with the circuit board

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Experimental program
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Embodiment Construction

[0040] 1A to 1D It is a cross-sectional schematic diagram of a manufacturing process of a circuit board according to an embodiment of the present invention. First, please refer to Figure 1A , the substrate 100 is provided. The substrate 100 includes a first dielectric layer 102 and a circuit layer disposed on the first dielectric layer 102 . In this embodiment, the first dielectric layer 102 has an upper surface 102a and a lower surface 102b opposite to each other, and a first circuit layer 104a is disposed on the upper surface 102a, and a first circuit layer 104b is disposed on the lower surface 102b. Then, an optical waveguide layer 106 is formed on a portion of the substrate 100 . The material of the optical waveguide layer 106 is, for example, but not limited to, silicon-based resin, acrylic, epoxy resin, polyimide, photocurable resin, thermoplastic resin, or glass fiber reinforced resin. The method for forming the optical waveguide layer 106 is, for example, to form ...

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PUM

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Abstract

The invention discloses a circuit board, a manufacturing method thereof and a photoelectric device with the circuit board. The circuit board includes a first dielectric layer and a substrate of the first circuit layer arranged on the first dielectric layer, an optical waveguide layer, a second dielectric layer, a convex structure and a second circuit layer. The optical waveguide layer is configured on part of the substrate. The second dielectric layer is disposed on the substrate and the optical waveguide layer, wherein the second dielectric layer has an opening, and the opening exposes the sidewall of the optical waveguide layer and part of the first circuit layer. The convex structure is disposed on the sidewall of the optical waveguide layer, wherein the convex structure has a refractive index n1, the optical waveguide layer has a refractive index n2, and |n1‑n2| / n1<1%, and the surface roughness of the convex structure is smaller than that of the optical waveguide The surface roughness of the sidewall of the layer. The second circuit layer is configured on the second dielectric layer.

Description

technical field [0001] The present invention relates to a circuit board, a manufacturing method thereof, and an optoelectronic device, and in particular, to a circuit board for bonding with optoelectronic components, a manufacturing method thereof, and an optoelectronic device having the circuit board. Background technique [0002] With the increase of information capacity, in addition to communication fields such as trunk lines and access systems, optical interconnection technology of optical signals is also being used in information processing in routers or servers. Specifically, in order to use light in short-distance signal transmission between or within boards in routers or server devices, circuit boards having optical transmission paths are currently being developed. Regarding the optical transmission path, the optical waveguide (waveguide) has a higher degree of freedom of wiring than the optical fiber, and the optical waveguide can be increased in density. [0003] ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/46G02B6/42
Inventor 黄培彰刘文芳余丞博
Owner UNIMICRON TECH CORP