Circuit board and its manufacturing method and optoelectronic device with the circuit board
A manufacturing method and circuit board technology are applied in multilayer circuit manufacturing, optical waveguide coupling, printed circuit components, etc., which can solve problems such as optical signal loss, affecting device performance, and large surface roughness of the optical waveguide layer. The effect of reducing strength loss
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[0040] 1A to 1D It is a cross-sectional schematic diagram of a manufacturing process of a circuit board according to an embodiment of the present invention. First, please refer to Figure 1A , the substrate 100 is provided. The substrate 100 includes a first dielectric layer 102 and a circuit layer disposed on the first dielectric layer 102 . In this embodiment, the first dielectric layer 102 has an upper surface 102a and a lower surface 102b opposite to each other, and a first circuit layer 104a is disposed on the upper surface 102a, and a first circuit layer 104b is disposed on the lower surface 102b. Then, an optical waveguide layer 106 is formed on a portion of the substrate 100 . The material of the optical waveguide layer 106 is, for example, but not limited to, silicon-based resin, acrylic, epoxy resin, polyimide, photocurable resin, thermoplastic resin, or glass fiber reinforced resin. The method for forming the optical waveguide layer 106 is, for example, to form ...
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