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Apparatus and method for adhering member

A technology for sticking devices and components, which is applied in the directions of electrical components, secondary processing of printed circuits, and manufacturing of printed circuits, can solve the problems of unstable accuracy, easy deterioration of components, and large energy loss, and achieves simple structure and reliable fixation. , the effect of high-precision processing

Active Publication Date: 2014-05-21
YAMAHA FINE TECHNOLOGIES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in the thermocompression bonding device, since the entire base film with the reinforcing plate attached is heated, there are problems such as large energy loss and unstable accuracy due to the influence of heat.
In addition, there is also a problem that the components of the thermocompression bonding device are easily deteriorated due to the influence of heat.

Method used

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  • Apparatus and method for adhering member
  • Apparatus and method for adhering member
  • Apparatus and method for adhering member

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach ）

[0029] Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. figure 1 The sticking device 10 of the components of this embodiment is shown. This part sticking device 10 is a fixed part for conveying the film-shaped small part A arranged on the upper surface of the bracket 11 and sticking it to the fixed part 13 composed of an electronic substrate provided on the upper surface of the fixing table 12. part 13a of the device. The small part A is made of thermoplastic polyimide, and when heated to about 200° C., it can be plasticized to produce adhesiveness, and is fixed to the fixed portion 13 a after being cured. In addition, as a material constituting the small part A, a thermoplastic resin material or a thermosetting resin material other than polyimide may be used.

[0030] In addition, the fixed member 13 is formed of a resin material such as polyimide. The component sticking device 10 includes a transport device 10a for...

no. 2 approach ）

[0065] Figure 6 The heating and holding device 61 included in the component sticking device according to the second embodiment of the present invention is shown. In this heating and holding device 61 , the holding portion 65 does not hold the small piece component A or the small piece component B by suction, but is configured to hold the small piece component A or the small piece component B by gripping using a mechanical mechanism. As the holding portion 65, various structures can be used, for example, a frame-shaped structure capable of holding the small piece A or the small piece B by inserting the small piece A or the small piece B into the frame, or a structure having multiple A claw and can hold the structure of small piece A or small piece B by pinching small piece A or small piece B with the claw. The structure of other parts of this heating and holding device 61 is the same as that of the above-mentioned heating and holding device 41 . Therefore, the same reference...

no. 3 approach ）

[0071] Figure 8 The heating and holding device 81 included in the component sticking device according to the third embodiment of the present invention is shown. In this heating and holding device 81 , a holding portion 85 is configured such that a solenoid 85 b for generating magnetism is housed in a box-shaped housing portion 85 a made of a steel plate. Moreover, the wiring 85c connected to the solenoid 85b extends outside from the upper part of the accommodating part 85a. The holding portion 85 attracts the small piece component C to the lower surface of the accommodating portion 85a by magnetic attraction force generated by the solenoid 85b. The small part C is composed of a thin stainless steel plate and an adhesive layer formed on the lower surface of the stainless steel plate, as in the small part B, but magnetic stainless steel is used for the stainless steel plate. The structure of other parts of the heating and holding device 81 is the same as that of the above-men...

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PUM

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Abstract

The present invention provides an apparatus for adhering a member. A conveying device (10a) equipped on the apparatus (10) for adhering the member is used for conveying a thin-plate-shaped small sheet component (A) of which the lower surface becomes an adhering surface and furthermore the thin-plate-shaped small sheet component is adhered on a fixed part (13a) of a fixed component (13). Additionally, the adhering surface of the thin-plate-shaped small sheet component (A) and the fixed part (13a) are formed by a material which can be adhered through compression jointing with each other in a heated state. The conveying device (10a) is provided with the components of: a holding part (24) for holding the small sheet component (A), a heating part (23b) which heats the small sheet component (A) by the holding part (24) through heating the holding part (24), and pressing parts (21,22) for pressing the small sheet component (A) to the fixed part (13a) of the fixed component (13).

Description

technical field [0001] The invention relates to a sticking device and a sticking method for sticking a component to a fixed component. Background technique [0002] Conventionally, for example, when manufacturing a flexible printed circuit board, a member made of a protective film is attached to a wiring pattern formation surface of a resin substrate on which a wiring pattern is formed to protect the wiring pattern. In this case, an affixing device that affixes a component cut into a predetermined shape to a substrate is used (for example, refer to Japanese Patent No. 4719790). In this sticking device, the reinforcing plate (part) formed by the reinforcing plate production device is pasted to a predetermined position of the base film held on the base film holding table by the reinforcing plate sticking arm, and the reinforced plate is pasted by the base film conveying device. After the base film is transported to the thermocompression bonding device, the base film and the r...

Claims

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Application Information

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IPC IPC(8): H05K3/28
CPCH05K3/281H05K3/381
Inventor 石井彻
Owner YAMAHA FINE TECHNOLOGIES CO LTD
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