Apparatus and method for adhering member

A technology for sticking devices and components, which is applied in the directions of electrical components, secondary processing of printed circuits, and manufacturing of printed circuits, can solve the problems of unstable accuracy, easy deterioration of components, and large energy loss, and achieves simple structure and reliable fixation. , the effect of high-precision processing

Active Publication Date: 2014-05-21
YAMAHA FINE TECHNOLOGIES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in the thermocompression bonding device, since the entire base film with the reinforcing plate attached is heated, there are problems such as large energy loss and unstable a

Method used

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  • Apparatus and method for adhering member
  • Apparatus and method for adhering member
  • Apparatus and method for adhering member

Examples

Experimental program
Comparison scheme
Effect test

Example

[0028] (First Embodiment)

[0029] Hereinafter, the first embodiment of the present invention will be described with reference to the drawings. figure 1 The component sticking device 10 of this embodiment is shown. The component sticking device 10 is used to transport the thin film-shaped small piece component A arranged on the upper surface of the tray 11 and stick it to the fixed component 13 composed of an electronic substrate and set on the upper surface of the fixing table 12 to be fixed. The device of section 13a. The small piece member A is made of thermoplastic polyimide, can be plasticized when heated to about 200° C. to produce adhesiveness, and is fixed to the fixed portion 13a after curing. In addition, as a material constituting the small piece member A, thermoplastic resin materials or thermosetting resin materials other than polyimide may also be used.

[0030] In addition, the fixed member 13 is formed of a resin material such as polyimide. The component sticking...

Example

[0064] (Second embodiment)

[0065] Image 6 The heating holding device 61 included in the component bonding apparatus of the second embodiment of the present invention is shown. In this heating and holding device 61, the holding portion 65 does not hold the small piece component A or the small piece component B by suction, but is configured to hold the small piece component A or the small piece component B by gripping with a mechanical mechanism. As the holding portion 65, various structures can be used. For example, a structure formed in a frame shape and capable of holding the small piece member A or the small piece member B by inserting the small piece member A or the small piece member B into the frame, or having multiple The structure of the small piece member A or the small piece member B can be held by using the two claw portions to hold the small piece member A or the small piece member B. The structure of the rest of the heating and holding device 61 is the same as tha...

Example

[0070] (Third Embodiment)

[0071] Figure 8 The heating holding device 81 included in the component bonding apparatus of the third embodiment of the present invention is shown. In this heating holding device 81, the holding portion 85 is configured to house a solenoid 85b for generating magnetism in a box-shaped accommodating portion 85a made of a steel plate. In addition, the wiring 85c connected to the solenoid 85b extends from the upper portion of the housing portion 85a to the outside. The holding portion 85 attracts the small piece member C to the lower surface of the accommodating portion 85a by the magnetic attraction force generated by the solenoid 85b. The small piece component C, like the small piece component B, is composed of a thin stainless steel plate and an adhesive layer formed on the lower surface of the stainless steel plate, but the stainless steel plate uses magnetic stainless steel. The structure of the other parts of the heating and holding device 81 is ...

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PUM

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Abstract

The present invention provides an apparatus for adhering a member. A conveying device (10a) equipped on the apparatus (10) for adhering the member is used for conveying a thin-plate-shaped small sheet component (A) of which the lower surface becomes an adhering surface and furthermore the thin-plate-shaped small sheet component is adhered on a fixed part (13a) of a fixed component (13). Additionally, the adhering surface of the thin-plate-shaped small sheet component (A) and the fixed part (13a) are formed by a material which can be adhered through compression jointing with each other in a heated state. The conveying device (10a) is provided with the components of: a holding part (24) for holding the small sheet component (A), a heating part (23b) which heats the small sheet component (A) by the holding part (24) through heating the holding part (24), and pressing parts (21,22) for pressing the small sheet component (A) to the fixed part (13a) of the fixed component (13).

Description

technical field [0001] The invention relates to a sticking device and a sticking method for sticking a component to a fixed component. Background technique [0002] Conventionally, for example, when manufacturing a flexible printed circuit board, a member made of a protective film is attached to a wiring pattern formation surface of a resin substrate on which a wiring pattern is formed to protect the wiring pattern. In this case, an affixing device that affixes a component cut into a predetermined shape to a substrate is used (for example, refer to Japanese Patent No. 4719790). In this sticking device, the reinforcing plate (part) formed by the reinforcing plate production device is pasted to a predetermined position of the base film held on the base film holding table by the reinforcing plate sticking arm, and the reinforced plate is pasted by the base film conveying device. After the base film is transported to the thermocompression bonding device, the base film and the r...

Claims

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Application Information

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IPC IPC(8): H05K3/28
CPCH05K3/281H05K3/381
Inventor 石井彻
Owner YAMAHA FINE TECHNOLOGIES CO LTD
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