A method for testing without needle marks
A test method and needle mark technology, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve problems such as the inability to use general fixtures, and achieve the effect of non-destructive testing and solving the problem of needle marks
Active Publication Date: 2016-08-17
GCI SCI & TECH
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Problems solved by technology
The general fixture test requires the use of fixtures, and the fixture itself has requirements on the size and structure of the circuit board. For some small-sized circuit boards without positioning holes, the general fixture test cannot be used.
Method used
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[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0015] see figure 1 , is a schematic flow chart of a needle-free testing method provided by the present invention, the method comprising the following steps:
[0016] Step 101: Disposing conductive adhesives on the first non-conductive carrier and the second non-conductive carrier respectively, and each conductive adhesive is respectively connected to the detection circuit.
[0017] In this embodiment, the first non-conductive carrier and the second non-conductive...
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The invention discloses a needle-mark-free testing method. The needle-mark-free testing method comprises the steps that conductive adhesives are arranged on a first non-conductive carrier and a second non-conductive carrier and connected with detection circuits respectively; the conductive adhesive of the first non-conductive carrier makes contact with a top circuit of a circuit board to be detected, and the conductive adhesive of the second non-conductive carrier makes contact with a bottom circuit of the circuit board to be detected, wherein the top circuit and the bottom circuit are located on the same network of the circuit board to be detected. According to detection indications provided by the detection circuits, detection results of the circuit board to be detected are determined. According to the needle-mark-free testing method, a surface and surface contact mode replaces a point and surface contact mode, the problem that needle marks are produced during testing of the circuit board, and non-damage testing is achieved.
Description
technical field [0001] The invention relates to the technical field of circuit board detection, in particular to a needle-free testing method. Background technique [0002] The circuit board is used as the carrier or motherboard for packaging and welding, ensuring its basic electrical performance is the basis for subsequent processing. After the production and processing of the circuit board, the circuit board needs to be tested to ensure its electrical performance. With the development of the electronics industry, higher standards are required for circuit board performance and appearance, and higher requirements for high-quality testing, especially in non-destructive testing. In the prior art, commonly used testing methods are moving flying probe testing and universal fixture testing. The mobile flying probe test is performed by pricking the test point with the test probe. Since the tip of the probe is relatively sharp, some slight or serious needle marks will appear more...
Claims
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IPC IPC(8): G01R31/02G01R1/04
Inventor 左青松向鹏杨杰刘俊黄概
Owner GCI SCI & TECH