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Nondestructive test method of LED chips

A LED chip, non-destructive testing technology, applied in the direction of single semiconductor device testing, etc., can solve the problems such as LED chip electrode damage can not be solved, and achieve the effect of reducing testing cost, simple operation, and increasing the frequency of use

Inactive Publication Date: 2015-06-03
SHANDONG INSPUR HUAGUANG OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method belongs to the technical field of circuit board detection and cannot solve the problem of electrode damage in LED chip testing.

Method used

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  • Nondestructive test method of LED chips
  • Nondestructive test method of LED chips
  • Nondestructive test method of LED chips

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Experimental program
Comparison scheme
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Embodiment Construction

[0021] The LED chip non-destructive testing method of the present invention comprises the following steps:

[0022] (1) Preparation of electrode conductive film

[0023] The structure of the electrode conductive film is as follows Figure 5 As shown, it includes a transparent insulating substrate 9 and a transparent conductive groove 8 arranged on the substrate. The transparent conductive groove 8 can be divided into a positive electrode conductive groove and a negative electrode conductive groove. The shape and size of the positive electrode conductive groove are consistent with the shape of the positive electrode of the LED chip 2. The shape and size of the negative electrode conductive groove are consistent with the shape and size of the negative electrode of the LED chip 2. Depending on the pattern of the electrodes of the LED chip, transparent conductive grooves of different shapes can be provided. The base 9 has insulation, light transmission and anti-pollution propert...

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Abstract

The invention discloses a nondestructive test method of LED chips. The nondestructive test method comprises the following steps: (1) preparing electrode conducting films, wherein each electrode conducting film comprises a transparent insulated substrate and a transparent conductive groove formed in the substrate; (2) covering the surfaces of LED chips to be tested with the electrode conducting films, so that positive electrodes and negative electrodes of the LED chips are located in the corresponding transparent conductive grooves; (3) pricking two probes of an automatic testing machine in the electrode conducting films to contact with location regions of the positive electrodes and the negative electrodes; (4) removing the electrode conducting films after the test is completed. The nondestructive test method replaces the direct contact with indirect contact between the test probes and the electrodes of the LED chips, and the surfaces of the chip electrodes are covered by the electrode conducting films as protection, so that the problem of probe marks in the test of LED chips is solved, the nondestructive test is realized, and the electrodes are protected; meanwhile, the nondestructive test method is simple to operate, increases the use frequency of test probes, and reduces the test costs.

Description

technical field [0001] The invention relates to a method for testing the photoelectric performance and appearance of an LED chip, and belongs to the technical field of LED chip testing. Background technique [0002] As the core component of semiconductor lighting, LED chips ensure their basic photoelectric performance and appearance requirements are the basis for subsequent processing. After the production and processing of LED chips is completed, the chips need to be tested in order to classify them according to their photoelectric parameters. With the development of packaging technology and applications, the current LED market has put forward higher and stricter requirements for the photoelectric performance and appearance of LED chips, and also put forward higher requirements for high-quality testing, especially in terms of nondestructive testing. [0003] In the existing LED chip testing technology, the automatic testing machine is generally used for testing, such as ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26
Inventor 曹志芳闫宝华夏伟徐现刚
Owner SHANDONG INSPUR HUAGUANG OPTOELECTRONICS