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A method of testing the open circuit in a hole with a glove

A technology for testing holes and gloves, which is applied in the direction of measuring electricity, measuring devices, and measuring electrical variables. It can solve problems such as high precision requirements, affecting yield, and easily damaged circuit boards, so as to simplify the processing process and solve the problem of needle marks. Effect

Active Publication Date: 2016-08-17
GCI SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since the existing open and short circuit detection in the hole mainly uses the test probe for electrical measurement, it is easy to leave needle marks on the tin surface, and for circuits with complex circuits, the precision of the drilling process is very high, and it is easy to damage the circuit board , affecting the yield

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0017] see figure 1 , is a schematic flow chart of a method for testing an open circuit in a hole with a glove provided by the present invention, and the method includes the following steps:

[0018] Step 101: Put on the glove, the glove is provided with a detection circuit, and conductive substances are respectively provided on the index finger and the thumb of the glove.

[0019] The method for testing the open circuit in the hole of the present invention is to ...

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Abstract

The invention discloses a method for testing an in-hole open circuit with a glove. The method includes the steps of wearing the glove, wherein the glove is provided with a detection circuit, the forefinger and the thumb of the glove are respectively provided with electric conduction matter, and the detection circuit is respectively connected with the electric conduction matter on the forefinger and the thumb; enabling the electric conduction matter on the forefinger to be in contact with a top layer circuit of one network hole, enabling the electric conduction matter on the thumb to be in contact with a bottom layer circuit of the network hole, and enabling the top layer circuit, the detection circuit and the bottom layer circuit to be sequentially connected in series; determining that the network hole can be broken over if a detection indication is sent by the detection circuit, or determining the network hole to be the open circuit if the detection indication is not sent by the detection circuit. By means of the technical scheme, the condition of the in-hole open circuit of the network hole in a circuit board can be detected, the process flow can be simplified, and the problem of needle marks can be solved.

Description

technical field [0001] The invention relates to the technical field of circuit board detection, in particular to a method for testing an open circuit in a hole with a glove. Background technique [0002] The circuit board is used as the carrier or motherboard for packaging and welding, ensuring its basic electrical performance is the basis for subsequent processing. In the existing circuit board processing flow, the following processing procedures are usually used for processing. First, the front-end processing of the circuit board is carried out, followed by tinning, drilling (removing the influence of tinned leads), electrical testing (testing open and short circuits), edge (cutting into small pieces and removing tinned leads), and final inspection ( inspection appearance) and packaging. With the development of the electronics industry, the diversification trend of the circuit board structure is becoming more and more obvious. For the tin-plated circuit board, the networ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/02
Inventor 左青松向鹏杨杰刘俊黄概
Owner GCI SCI & TECH