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A method for optimizing the number of pulsed lasers and a method for testing the cross-section of single-event flipping

A single-particle inversion and pulsed laser technology, applied in electronic circuit testing, non-contact circuit testing, instruments, etc., can solve the problems of reducing the number of inversions and large cross-sectional data, achieving uniform distribution, reducing multi-bit inversions, and applying accurate effect

Active Publication Date: 2016-08-24
NAT SPACE SCI CENT CAS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem of excessive multi-bit flipping or the same bit being irradiated twice due to the relatively large laser spot area when using pulsed laser to test the single event flip section of an ultra-deep submicron process device The number of flips is reduced, which leads to the problem of large or small cross-section data, so a method for optimizing the number of pulsed lasers and a test method for single-particle flip cross-sections is proposed.

Method used

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  • A method for optimizing the number of pulsed lasers and a method for testing the cross-section of single-event flipping
  • A method for optimizing the number of pulsed lasers and a method for testing the cross-section of single-event flipping
  • A method for optimizing the number of pulsed lasers and a method for testing the cross-section of single-event flipping

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Embodiment 1

[0071] Pulse laser simulation HM62V16100i single event flipping effect test, the test system diagram is as follows figure 1 Shown: 1-1 is the pulse laser (laser pulse width is adjustable, the range is femtosecond fs, picosecond ps and nanosecond ns level), 1-2 is the laser energy adjustment unit, 1-3 is the laser energy beam splitter device, 1-4 is the laser energy meter, 1-5 is the autofocus system, 1-6 is the color CCD camera, 1-7 is the microscope, 1-8 is the autofocus unit, 1-9 is the autofocus objective lens, 1-10 1-11 is the XY translation platform for the device under test, 1-12 is the PCB board used for testing the device (including the device hardware test unit), 1-13 is the measurement and control computer, 1-14 is the test control system of the device under test; 2 -1 is the laser energy (nJ), 2-2 is the laser spot diameter (μm); 3-1 is the chip width, 3-2 is the laser spot, 3-3 is the width of a functional unit of the chip Δ x , 3-4 is the length Δ of a functional...

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Abstract

The invention relates to a pulse laser number optimizing method which is used for optimizing the pulse laser number of a single-particle overturn cross section of a pulse laser tester. The pulse laser number F of a certain pulse energy Ei is determined by the steps of 101) obtaining the light-spot area tau and the area delta of a single function unit of the tester under the laser energy; 102) obtaining a decided reference value, which is the ratio of the light-spot area tau to the area delta, of the laser number; and 103) determining the laser number according to the light-spot area when the decided reference value is greater than 1, and determining the laser number according to the area of the single function unit when the decided reference value is lower than 1. When the decided reference value n is greater than 1, the laser amount F=1 / ktau; when n is lower than 1, the laser amount F=1 / kdelta; and k represents a modulation factor whose value range is from 1 to 25.

Description

technical field [0001] The present invention mainly relates to a new method of using pulsed laser simulation test to test the single event flip cross section of a device, which is a test method mainly for the single particle flip cross section test of digital devices such as memory, microprocessor and FPGA, and belongs to space environment radiation Effect ground simulation test technical field. Background technique [0002] In recent years, with the gradual reduction of the feature size of the semiconductor process, the digital CMOS devices used in my country's space missions are gradually dominated by ultra-deep submicron devices. The above-mentioned devices are usually microprocessors, Highly integrated chips such as FPGA and memory. When in the radiation environment of high-energy charged particles in outer space, the probability of abnormal operation of the chip caused by the single event flipping effect gradually increases with the decrease of the process size. In vie...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/311G01J11/00
Inventor 封国强上官士鹏韩建伟马英起余永涛姜昱光朱翔陈睿
Owner NAT SPACE SCI CENT CAS
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