Unlock instant, AI-driven research and patent intelligence for your innovation.

Power module package

A technology for power modules and seals, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc.

Inactive Publication Date: 2014-06-18
SAMSUNG ELECTRO MECHANICS CO LTD
View PDF6 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in addition to the method of reducing the size of the electronic components themselves, the method of mounting as many components and wiring as possible in a predetermined space has become an important challenge when designing power module packages

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Power module package
  • Power module package
  • Power module package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0056] figure 2 is a sectional view showing the structure of a power module package according to a second preferred embodiment of the present invention; and image 3 with Figure 4 is a sectional view showing a bonding portion of an external connection terminal and a connector in a power module package according to a second preferred embodiment of the present invention.

[0057] In the second preferred embodiment of the present invention, descriptions of components overlapping with those described in the above-mentioned first preferred embodiment will be omitted. In addition, the same reference numerals will be used to describe the same components as those described in the first preferred embodiment.

[0058] refer to figure 2 , The power module package 200 according to the second preferred embodiment of the present invention may include a substrate 110, semiconductor chips 120a and 120b, external connection terminals 130a and 130b, and electrical and mechanical connectio...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed herein is a power module package, including: a substrate; semiconductor chips mounted on one surface of the substrate; external connection terminals connected to one surface of the substrate; and a connecting member having one end contacting the semiconductor chips and the other end contacting the external connection terminals and electrically and mechanically connecting between the semiconductor chips and the external connection terminals.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2012-0146345 filed with the Korean Intellectual Property Office on Dec. 14, 2012, entitled "Power Module Package", the disclosure of which is incorporated by reference in this. technical field [0003] The present invention relates to power module packaging. Background technique [0004] Recently, with the development of the power electronics industry, electronic products have been miniaturized and increased in density. Therefore, in addition to a method of reducing the size of the electronic components themselves, a method of mounting and wiring as many components as possible in a predetermined space has become an important challenge in designing a power module package. [0005] Meanwhile, the structure of a power module package according to the prior art has been disclosed in US Patent No. 5,920,119. Contents of the invention [0006] The pr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/48H01L25/07H01L25/18
CPCH01L23/24H01L2224/48091H01L23/053H01L23/48H01L23/3735H01L2224/73265H01L2224/48137H01L24/73H01L23/49811H01L23/495H01L2924/13091H01L2924/13034H01L2924/13055H01L2924/1305H01L2924/15787H01L2924/181H01L2224/01H01L2224/32225H01L2924/00014H01L2924/00H01L2924/00012
Inventor 俞度在金泰贤金洸洙蔡埈锡
Owner SAMSUNG ELECTRO MECHANICS CO LTD