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Low temperature bonding method of zirconia ceramics

A zirconia ceramic, low-temperature technology, applied in the field of low-temperature bonding, can solve problems such as poor sensor performance, and achieve highly innovative effects

Active Publication Date: 2014-06-25
SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, with the rapid development of the automobile industry, the demand for automotive oxygen sensors is increasing. At present, automotive oxygen sensors have developed from tube-type to chip-type and NOx, but at present, domestic chip-type oxygen sensors cannot enter the vehicle market. NOx The sensor is still in the research and development stage. There are many reasons for the poor performance of the above sensors, among which the connection between the sintered ceramic substrates is one of the important aspects.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0028] Follow the steps below to carry out the low-temperature bonding method for zirconia ceramic substrates:

[0029] (1) Prepare CaO-Al according to the steps of preparing glass in the prior art 2 o 3 -SiO 2 (CAS) glass powder;

[0030] (2) The prepared CAS glass is ground with a mortar, and after adding deionized ball milling for 10 hours to obtain a particle size of 0.6 micron CAS glass powder slurry, the mixed slurry of CAS glass powder and deionized water at 120 CAS glass powder with a particle size of 0.6 microns was obtained after drying in a constant temperature oven at ℃ for 10 hours;

[0031] (3) Weigh CAS glass powder 10g and 5Y 2 o 3 -ZrO 2 (YSZ) powder 40g, use deionization as the dispersion medium, wherein, deionized water accounts for 50% of the total mass of the powder, after ball milling on the planetary mill for 10 hours, the mixed CAS-YSZ slurry is obtained for subsequent use;

[0032] (4) Coat the CAS-YSZ slurry evenly on a flat YSZ substrate, cove...

Embodiment 2

[0035] Follow the steps below to carry out the low-temperature bonding method for zirconia ceramic substrates:

[0036] (1) Prepare BaO-Al according to the steps of preparing glass in the prior art 2 o 3 -SiO 2 (BAS) glass powder;

[0037](2) The prepared BAS glass is ground with a mortar, and after adding deionized ball milling for 10 hours, the BAS glass powder slurry with a particle size of 0.68 microns is obtained, and the mixed slurry of BAS glass powder and deionized water is heated at 120 After drying in a constant temperature oven at ℃ for 10 hours, a BAS glass powder with a particle size of 0.68 microns was obtained;

[0038] (3) Weigh BAS glass powder 15g and 5Y 2 o 3 -ZrO 2 (YSZ) powder 35g, use deionization as the dispersion medium, wherein deionized water accounts for 50% of the total mass of the powder, after ball milling on the planetary mill for 10 hours, the mixed LAS-YSZ slurry is obtained for subsequent use;

[0039] (4) Coat the LAS-YSZ slurry evenly...

Embodiment 3

[0042] Follow the steps below to carry out the low-temperature bonding method for zirconia ceramic substrates:

[0043] (1) prepare Li according to the step of preparing glass in the prior art 2 O-Al 2 o 3 -SiO 2 (LAS) glass powder;

[0044] (2) Grinding the prepared LAS glass with a mortar, adding deionized ball milling for 10 hours to obtain a particle diameter of 0.5 micron LAS glass powder slurry, mixing the slurry of LAS glass powder and deionized water at 120 After drying in a constant temperature oven at ℃ for 10 hours, LAS glass powder with a particle size of 0.5 microns was obtained;

[0045] (3) Weigh 10g of LAS glass powder and 5Y 2 o 3 -ZrO 2 (YSZ) powder 40g, use deionization as the dispersion medium, wherein deionized water accounts for 50% of the total mass of the powder, after ball milling on the planetary mill for 10 hours, the mixed LAS-YSZ slurry is obtained for subsequent use;

[0046] (4) Coat the LAS-YSZ slurry evenly on a flat YSZ substrate, cove...

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Abstract

The invention discloses a low temperature bonding method of zirconia ceramics, which comprises the following steps: preparing CAS, BAS and LAS glass according to a glass preparation step; grinding the prepared LAS glass with a mortar, adding deionized water, performing ball milling to obtain LAS glass powder, drying mixed slurry of CAS, BAS, LAS glass and deionized water in a constant temperature oven to obtain CAS, BAS and LAS glass powder; mixing CAS, BAS and LAS glass powder with 5Y2O3-ZrO2 (YSZ) powder according to a certain ratio to obtain CAS-YSZ, BAS-YSZ, and LAS-YSZ slurry to keep in reserve; uniformly coating a flat and straight YSZ substrate with the slurry, covering the substrate with another flat and straight YSZ substrate, performing heat preservation at a certain temperature for 0.5 hour, and then cooling in a furnace to obtain the zirconia ceramic material with good bonding performance. The bonding agent obtained in the invention can be used for preparation of flat or NOX sensors, and the preparation method has the advantages of safety, time saving, and energy saving, and is a new method with great application prospects.

Description

technical field [0001] The invention relates to a low-temperature bonding method capable of bonding zirconia ceramics at relatively low temperature (975-1300°C). The low-temperature bonding method is used for bonding between zirconia structural ceramics and functional ceramics. The most typical use is as a binder between zirconia ceramic substrates in the preparation of automotive oxygen sensor sensitive components. Background technique [0002] Co-fired multilayer ceramic substrates are made of many monolithic ceramic substrates through lamination, hot pressing, degumming, sintering and other processes. Since the number of layers of the co-fired ceramic multilayer substrate can be made more, the wiring density is higher, and the length of the interconnection line can be shortened as much as possible, so that the assembly density and signal transmission speed can be improved. Because the co-fired ceramic multilayer substrate can meet the requirements of the electronic mach...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/00
Inventor 夏金峰冯涛郇昌天粘洪强蒋丹宇王琪
Owner SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI