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Electronic part installation apparatus

A technology for electronic component installation and electronic components, applied in the direction of electrical components, electrical components, etc., can solve problems such as bad influence of the substrate, poor yield, deformation of lead wires of electronic components, etc., and achieve the effect of cheap structure

Active Publication Date: 2014-06-25
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if the electronic components cannot be properly mounted, the lead wires of the electronic components may be deformed or the substrate may be adversely affected, which may cause a decrease in yield.

Method used

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  • Electronic part installation apparatus
  • Electronic part installation apparatus
  • Electronic part installation apparatus

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Embodiment Construction

[0037] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by the form (henceforth embodiment) for carrying out the invention mentioned below. In addition, the constituent elements in the following embodiments include elements within the so-called equivalent range, such as elements that can be easily conceived by those skilled in the art, substantially the same elements, and the like. In addition, components disclosed in the following embodiments may be appropriately combined.

[0038]Hereinafter, embodiments of the electronic component mounting apparatus according to the present invention will be described in detail based on the drawings. In addition, this invention is not limited by this embodiment. The electronic component mounting device of the present invention is an electronic component mounting device for mounting a so-called plug-in type electronic component. The plug-i...

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Abstract

The invention provides an electronic part installation apparatus, which can be used to manage the electronic part installed on a substrate effectively and precisely. The electronic part installation apparatus comprises an electronic part supply apparatus that supplies a lead type electronic part; a loader main body that comprises a suction nozzle or a clamping nozzle, a nozzle driving part and a loader support body; and a loader control part, wherein the nozzle driving part has a motor; the loader control part comprises a motor action instruction part, a memory part and a comparison part; the memory part stores standard pattern of the current when being installed; the comparison part compares the current value of the motor and the standard pattern; a main control part uses the comparison part to compare the current value of the motor and the standard pattern, and if beyond the permit scope , the motor action instruction part is used to stop the installation action.

Description

technical field [0001] The present invention relates to an electronic component mounting device which inserts leads of an electronic component having a main body and leads connected to the main body into insertion holes of a substrate, and mounts the electronic component on the substrate. Background technique [0002] An electronic component mounting apparatus for mounting an electronic component on a substrate includes a mounting head having a suction nozzle, and the electronic component is held by the suction nozzle and mounted on the substrate. The electronic component mounting device moves the suction nozzle of the mounting head in a direction perpendicular to the surface of the substrate to absorb the components in the electronic component supply device, and then makes the mounting head face to face in a direction parallel to the surface of the substrate. After reaching the mounting position of the suctioned component, the suction nozzle of the mounting head moves in a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04
Inventor 松田和弥伊藤直也高桥和义伊势谷和宏
Owner JUKI CORP
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