Disassembling device of circuit board with components and parts and disassembling method of disassembling device

A component and circuit board technology, which is applied to the dismantling device and its dismantling field of circuit boards with components, to achieve the effects of no secondary pollution discharge, large processing capacity, and guaranteed automation

Active Publication Date: 2014-08-20
SHANGHAI JIAO TONG UNIV
View PDF10 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

None of the teardown setups for the board so far have done a good job of addressing these issues

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Disassembling device of circuit board with components and parts and disassembling method of disassembling device
  • Disassembling device of circuit board with components and parts and disassembling method of disassembling device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] The present invention will be further described below in conjunction with specific embodiments. The following examples are not intended to limit the present invention.

[0051] The present invention heats and desolders circuit boards with components through the combination of electric heating and hot air heating methods, and controls and ensures the uniformity of temperature distribution inside the automatic dismantling device; The combination of the board and the vibrating separation screen provides the circuit board with components with the required disassembly force and the power to move to the discharge end, ensuring the efficient disassembly and smooth discharge of the circuit board with components; The hot air discharged through the air outlet is purified and dust-removed, and then enters the air heating device to be heated again to become hot air under the required working conditions, and then introduces the automatic dismantling device to continue working and re...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
widthaaaaaaaaaa
Login to view more

Abstract

The invention discloses a disassembling device of a circuit board with components and parts and a disassembling method of the disassembling device. The disassembling device comprises a shell, a feeding gate valve, an air outlet, an air inlet, a soldering tin liquid discharging valve, a discharging gate valve, a rotary separating cylinder, a vibration separating screen, an electric heating device, a spring device, a soldering tin liquid containing tank, a transmission shaft, a vibration motor and a transmission motor, wherein the feeding gate valve, the air outlet, the air inlet, the soldering tin liquid discharging valve and the discharging gate valve are arranged on the shell, the rotary separating cylinder, the vibration separating screen, the electric heating device, the spring device, the soldering tin liquid containing tank and the transmission shaft are arranged inside the shell, and the vibration motor and the transmission motor are arranged outside the shell. A method integrating electric heating and hot air heating is used for controlling internal temperature to be distributed evenly, a mode integrating the rotary separating cylinder, a baffle and the vibration separating screen is used for providing required disassembling force and forward power for the circuit board, and therefore it is guaranteed that soldering tin liquid and the components and parts efficiently fall off from the circuit board and are smoothly discharged. The disassembling device and the disassembling method achieve an even heating temperature field, automatic and continuous feeding and discharging and cyclic utilization of hot air, the whole processing procedure is closed and cycled, and secondary pollution will not be produced.

Description

technical field [0001] The invention relates to the dismantling, recycling and regeneration of circuit boards with components, and belongs to the technical field of industrial waste treatment and resource utilization in the field of environmental protection. Device and method for recycling hazardous resources. Background technique [0002] With the development of science and technology, especially the rapid development of high-tech, the speed of electronic product replacement is accelerating. As an indispensable part of electronic products, the amount of discarded circuit boards is increasing day by day. According to statistics, the world's electronic waste is growing at a rate of 18%, becoming the fastest growing waste. Data show that the current e-waste generated in Europe is 6-8 million tons, and the e-waste in the United States accounts for 2%-5% of the total waste in the United States. In my country, since 2004, at least 5 million computers, 5 million TV sets, 50 mill...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/018
CPCB23K1/018B23K2101/42
Inventor 许振明王建波
Owner SHANGHAI JIAO TONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products