Method of testing and judging semi-conductive fracture insulation of cross-linked cables based on infrared imaging

Abstract

The invention discloses a method for testing and determining crosslinked cable semiconductive fracture insulativity based on infrared imaging. The method comprises the following steps of testing an infrared image of a 35kV cable terminal semiconductive fracture in an operation state by an infrared thermal imager, comparing the infrared image of the cable terminal semiconductive fracture and longitudinal and transverse infrared images of the cable so that analysis of a temperature and a temperature gradient at the cable terminal semiconductive fracture is finished, and eliminating influence produced by surface dirt and an environmental humidity factor and definitely determining the properties and a severe degree of insulativity hidden danger. Through the infrared thermal imager, the infrared images of the cable terminal semiconductive fracture in an operation state are taken and through the infrared images, thermal failure at the 35kV cable terminal semiconductive fracture is found. Through the image analysis, insulativity defect determination accuracy is improved, blackout inspection frequency and blackout time are reduced, and high economic and social benefits are produced.

Description

technical field [0001] The invention belongs to the technical field of electromechanical cross-linked cables, in particular to a method for testing and judging the insulation of semi-conductive fractures of cross-linked cables based on infrared imaging. Background technique [0002] 35kV cables are widely used in urban power grids, and there are many insulation breakdown faults at semi-conductive fractures of cable terminals during operation. Through years of statistical analysis of 35kV cross-linked cable accidents in power systems, it is found that insulation breakdown faults at semi-conductive fractures at cable terminals occupy If the proportion is large, the economic loss will be very large. Therefore, in the operating state, it is a very important research topic to discover the hidden trouble of the semi-conductive fracture of the cable terminal early, and make a clear judgment on the nature and severity of the hidden trouble. High, inaccessible to personnel, the tradi...

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Problems solved by technology

[0003] The purpose of the embodiment of the present invention is to provide a method for testing and judging the insulation of cross-linked cable semi-conductive fractures based on infrared imaging, aiming to solve the problem that the traditional test method cannot find the hidden danger of insulation at the semi-conductive fracture of cables

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