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Cover element and housing device for use of the cover element

A technology of cover components and components, applied in the field of housing devices using cover components, to achieve the effect of simple installation and simple manufacture

Inactive Publication Date: 2014-08-20
HKR SEUFFER AUTOMOTIVE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, it is generally difficult to arrange several and partly different components or semiconductor chips in one housing

Method used

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  • Cover element and housing device for use of the cover element
  • Cover element and housing device for use of the cover element
  • Cover element and housing device for use of the cover element

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0027] Next in the reference figure 1 The first embodiment of the present invention will be described below.

[0028] figure 1 Shown is a housing arrangement 1 in which a cover element 2 according to the invention is used. The housing arrangement 1 comprises, in addition to the cover element 2 , a housing lower part 3 which is designed in such a way that the cover element 2 and the housing lower part 3 can be connected to one another in order to form the housing arrangement. 1. The housing lower part 3 is referred to below simply as the lower part 3 .

[0029] In the housing device 1, an inner space 4 is formed between the cover element 2 and the lower part 3, in which the parts to be assembled and protected by means of the housing device 1, for example, have a plurality of electrical And electronic devices and circuit boards 5 of mechanical components. The invention in combination with the cover element 2 is not limited to the configuration of the circuit board 5 with ot...

no. 2 example

[0051] in reference figure 2 case, the second embodiment of the present invention will be described next. Components and components of the same type or identical to those in the description of the second embodiment are identified with the same reference numerals as in the first embodiment.

[0052] figure 2 show and in figure 1 A structure similar to that of the cover element 2 shown in , in which the housing device 1 is formed from the lower part 3 and the cover element 2 . The cover element 2 and the lower part 3 can be connected to each other. Fastening elements 14 and 15 are provided for this and a locking connection can be produced.

[0053] In the same way as in the first embodiment, according to the second embodiment, the contour of the lower surface 16 of the cover element 2 approximately follows the components 6 and 7 is the contour of the inner surface of the circuit board 5 . Likewise, at least one plug region 8 having an opening region 9 and contact pins 10...

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Abstract

The invention concerns a cover element (2) connectable to a housing lower portion (3) for covering same to form a housing device (1), wherein the cover element is formed in one piece as a shaped portion, the lower surface (16) of the cover element, that faces in the direction of the lower portion, is so designed that it follows the contour of the inside surface of the lower portion, and projections and recesses in the lower surface of the cover element are of such a configuration that recesses in the inside surface of the lower portion are at least partially filled and projections on the inside surface of the lower portion are at least partially surrounded in positively locking relationship.

Description

technical field [0001] The invention relates to a cover element, and in particular to a cover element designed as a shaped part for covering a housing lower part, and to a housing arrangement using the cover element. Background technique [0002] Document DE 19728992 A1 discloses a housing for semiconductor bodies (semiconductor chips), wherein the semiconductor bodies are inserted into the lower part of the housing and fixed. The remaining space inside the housing is cast so that a closure of the housing is formed and an individual module incorporating the semiconductor body is provided. [0003] Document US Pat. No. 7,462,919 B2 discloses a pressure-sensitive component by means of which a switching function can be triggered. The pressure-sensitive semiconductor chips are embedded in and surrounded by plastic layers. The pressure for triggering the switching function can be applied from above. Furthermore, the structure can have a plastic casing produced by casting. [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/03
CPCH05K5/062H05K5/03H05K7/20436
Inventor 奥利弗·施瓦布弗朗茨·赫特韦克沃尔夫冈·巴斯
Owner HKR SEUFFER AUTOMOTIVE
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