Material box for simultaneous feeding of LED packaging substrate and lens
A technology for LED packaging and substrates, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of complex feeding mechanism, reduced reliability, and many transfer links of feeding mechanism size, so as to simplify the complexity of the mechanism and improve the efficiency. and reliability, the effect of reducing the cost of equipment development
Active Publication Date: 2014-08-27
SOUTH CHINA UNIV OF TECH
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Problems solved by technology
[0005] 1. The feeding mechanism of high-power LED packaging substrate and lens bonding equipment will become very complicated; at the same time, due to the large number of transfer links in the size of the feeding mechanism, the reliability of the alignment guarantee of the substrate and lens glue injection hole and vent hole position to reduce accordingly
[0006] 2. In order to avoid interference with the LED packaging substrate and lens feeding mechanism, the cover lens mechanism of the bonding equipment will become complicated, and the cost will increase accordingly
Method used
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[0026] The purpose of the invention of the present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments, and the embodiments cannot be repeated here one by one, but the implementation of the present invention is not therefore limited to the following embodiments.
[0027] Such as figure 1 and figure 2 As shown, a magazine for simultaneous feeding of LED packaging substrates and lenses is characterized in that it includes a right support plate 12 and a left support plate 14 vertically arranged in parallel, the right support plate 12 and the left support plate 14 The top and the bottom are respectively connected with a material box top cover 11 and a material box bottom plate 13, and the vertical walls facing the right support plate 12 and the left support plate 14 are symmetrically arranged with a position group, and the position group includes from top to bottom The lens holder bin 25 where the lens holde...
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The invention discloses a material box for simultaneous feeding of an LED packaging substrate and a lens. The material box comprises a right supporting board and a left supporting board, wherein the right supporting board and the left supporting board are arranged in parallel. The top and the bottom of the right supporting board are connected with a material box top cover and a material box bottom board respectively, and the top and the bottom of the left supporting board are connected with the material box top cover and the material box bottom board respectively. The vertical walls, opposite to each other, of the right supporting box and the left supporting board are symmetrically provided with lens support bin positions of a horizontally-arranged lens support and substrate bin positions of a horizontally-arranged LED substrate from top to bottom in the perpendicular direction. According to the material box, locating and simultaneous feeding of the substrate and the lens support are achieved, under the condition that the mechanical precision of a single part (a push rod) of a pushing mechanism is ensured, alignment of the LED substrate and the lens support is directly achieved, the mechanical complexity degree of bonding equipment is simplified, equipment development cost is lowered, and efficiency and reliability are improved.
Description
[0001] technical field [0002] The invention relates to the technical field of LED module packaging, in particular to a material box for simultaneous feeding of LED packaging substrates and lenses. Background technique [0003] After the high-power LED chip packaging and phosphor coating process, the key part of its packaging is the subsequent processes such as the bonding of the substrate and the lens and the injection of silica gel. Due to the strict relative position relationship between the substrate and the lens, it requires the bonding equipment of the substrate and the lens, and requires strict positioning accuracy and motion accuracy in the mechanism. [0004] image 3 It is a schematic diagram of a package substrate 32 of 20 row-type high-power LEDs, such as Figure 4 , for each LED module 31, it includes a semiconductor chip, a pit for installing a lens, and a glue injection hole 311 and a vent hole 312 for injecting glue into the lens; Figure 5 It is a schemat...
Claims
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Login to View More IPC IPC(8): H01L33/00H01L21/67
CPCH01L21/67303H01L33/48H01L2933/0033
Inventor 刘伟东陈安胡跃明吴忻生
Owner SOUTH CHINA UNIV OF TECH