A simultaneous feeding device for LED package substrate and lens
A LED packaging and substrate technology, applied in transportation and packaging, electrical components, circuits, etc., can solve the problems of multiple size transfer links, complicated feeding mechanism, and reduced reliability of the feeding mechanism, so as to reduce equipment development costs and simplify Mechanism complexity, effect of improving efficiency and reliability
Inactive Publication Date: 2017-01-18
SOUTH CHINA UNIV OF TECH
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Problems solved by technology
[0004] 1. The feeding mechanism of high-power LED packaging substrate and lens bonding equipment will become very complicated; at the same time, due to the large number of transfer links in the size of the feeding mechanism, the reliability of the alignment guarantee of the substrate and lens glue injection hole and vent hole position to reduce accordingly
[0005] 2. In order to avoid interference with the LED packaging substrate and lens feeding mechanism, the cover lens mechanism of the bonding equipment will become complicated
Correspondingly, the cost will also increase
Method used
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[0029] The purpose of the invention of the present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments, and the embodiments cannot be repeated here one by one, but the implementation of the present invention is not therefore limited to the following embodiments.
[0030] The embodiments will be described in further detail below in conjunction with the accompanying drawings.
[0031] Such as Figures 1 to 3 As shown, a simultaneous feeding device for LED packaging substrates and lenses, including: a simultaneous feeding box 1, a longitudinal and vertical direction box movement mechanism 4 for conveying the simultaneous loading box 1, and a propulsion mechanism 3,
[0032] The simultaneous loading material box 1 includes a right support plate 12 and a left support plate 14 vertically arranged in parallel, and the top and bottom of the right support plate 12 and the left support plate 14 are respectively conne...
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The invention discloses a device for feeding an LED package substrate and a lens simultaneously. The device for feeding the LED package substrate and the lens simultaneously comprises a simultaneously feeding material box, a horizontal and vertical material box moving mechanism and a pushing mechanism, wherein the horizontal and vertical material box moving mechanism is used for conveying the simultaneously feeding material box and comprises a horizontally-moving mechanism and a vertically-moving mechanism, the horizontally-moving mechanism is used for supporting the simultaneously feeding material box and driving the simultaneously feeding material box to move horizontally to a predetermined position, the vertically-moving mechanism is used for pushing the simultaneously feeding material box in the vertical direction to a predetermined height, and the pushing mechanism is arranged on one side of the horizontally-moving mechanism and used for horizontally pushing the LED package substrate and the lens which are placed in the to a bonding station simultaneously. According to the device for feeding the LED package substrate and the lens simultaneously, the LED package substrate and a lens support are fed and pre-positioned simultaneously, the LED package substrate and the lens support are directly bonded after being aligned under the guarantee of the mechanical precision of a push rod of a material pushing mechanism, the development cost of the device is reduced, and the efficiency and the reliability are improved.
Description
technical field [0001] The invention mainly relates to the field of semiconductor application and packaging, in particular to a simultaneous feeding device for an LED packaging substrate and a lens. Background technique [0002] High-power LED lighting has the advantages of long life, high efficiency, and no pollution. As time goes by, it has received more and more attention. The packaging of high-power LEDs is an important part of the LED manufacturing process; for silicone lens-type LED lights, the bonding of the packaging substrate and lens is one of the key links in the LED manufacturing process. After the chip packaging and phosphor coating processes, subsequent processes such as the bonding of the packaging substrate and the lens and the injection of silica gel require a strict relative positional relationship between the substrate and the lens, which requires the bonding equipment of the substrate and the lens. Strict positioning accuracy and motion accuracy in the m...
Claims
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IPC IPC(8): H01L21/677H01L33/48
CPCH01L21/67781H01L2933/0033
Inventor 刘伟东陈安胡跃明吴忻生
Owner SOUTH CHINA UNIV OF TECH