Ingot Feeding System

Abstract

An ingot feeding system for a wire saw device, a wire saw device including the ingot feeding system and a method for feeding an ingot during cutting is described. The ingot feeding system includes a kinematic mechanism structure; at least one actuator for moving at least one part of the kinematic mechanism structure; a support table for coupling an ingot to the kinematic mechanism structure; and at least one sensor for measuring a force acting on the kinematic mechanism structure.

Description

technical field [0001] Embodiments of the present disclosure relate to ingot feeding systems for wire saw devices. Existing wire saws can be retrofitted with an ingot feeding system according to the present disclosure. The present disclosure particularly relates to multi-wire saws. The wire saw of the present disclosure is particularly suitable for cutting or sawing hard materials such as silicon or quartz blocks, eg, for cutting silicon wafers, for squarers, for cutters, and the like. Additionally, embodiments of the present disclosure relate to wire saw devices that include embodiments of the ingot feeding systems described herein. Additionally, embodiments of methods for feeding ingots during cutting are disclosed. Background technique [0002] Wire saws are used to cut blocks or bricks, slices, eg, semiconductor wafers, from a piece of hard material such as silicon. In such devices, the wire is fed from a bobbin and is guided and tensioned by a wire guide cylinder. ...

AI Technical Summary

Problems solved by technology

However, it turns out that this does not give enough information for optimizing the sawing process and does not adequately avoid irregularities during the cutting process

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