Temperature processing device and method in satellite thermal test

A technology of processing device and thermal test, applied in thermometers using electrical/magnetic components directly sensitive to heat, simulating devices for spaceflight conditions, thermometers, etc. and cables, etc., to achieve the effect of solving complex connection relationships, saving flanges and special ground test equipment

Inactive Publication Date: 2014-10-01
SHANGHAI ENG CENT FOR MICROSATELLITES
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Problems solved by technology

However, the above method has the following disadvantages: one, it will cause the use of a large number of connectors and cables; two, it will waste a lot of manpower and mat

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  • Temperature processing device and method in satellite thermal test
  • Temperature processing device and method in satellite thermal test
  • Temperature processing device and method in satellite thermal test

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Embodiment Construction

[0017] The specific implementations of the temperature processing device and method for the satellite thermal test provided by the present invention will be described in detail below in conjunction with the accompanying drawings. The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted here that in different icons, the same component symbols represent the same or similar components.

[0018] see figure 2 , In an embodiment of the present invention, a temperature processing device for a satellite heat test is provided, which includes a satellite bottom plate 210 and at least one satellite side plate 220 . In the embodiment of the present invention, the number of satellite side panels 220 is four, that is, the first satellite side panel 220 , the second satellite side panel 220 , the third satellite side panel 220 and the fourth satellite side panel 220 . At least one digital temperatur...

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Abstract

The invention discloses a temperature processing device and method in a satellite thermal test. The device comprises a satellite bottom plate and at least one satellite side plate. One of the satellite side plates and the satellite bottom plate is provided with a digital temperature sensor used for collecting the temperature of the satellite side plates or the satellite bottom plate and sending the temperature to a satellite-mounted computer. The satellite-mounted computer is arranged on the satellite bottom plate and used for receiving the temperature collected by the digital temperature sensor and transmitting and forwarding the temperature to a terminal for later processing. The digital temperature sensor is used for replacing a traditional thermocouple, and therefore the problem of the complex connection relation of the thermocouple is solved. Meanwhile, a digital temperature sensor interface integrated through the satellite-mounted computer is utilized, temperature collecting is achieved, the temperature is transmitted to the ground, and therefore a large number of flanges and special ground testing devices are saved, and the effects of saving labor and force are achieved.

Description

technical field [0001] The invention relates to the technical field of aerospace measurement and control, in particular to a temperature processing device and method for a satellite thermal test. Background technique [0002] In the field of aerospace, it is often necessary to conduct vacuum thermal test assessments on satellites. During the vacuum thermal test, it is necessary to create a thermal environment for the object to be tested, and the thermal environment requires a large number of temperature collections. At present, the usual practice is to add the process of thermal control star modification (that is, adding thermocouples, heaters, etc. required for vacuum thermal tests on the satellite) to the satellite development process. This process is completed manually. see figure 1 As shown, in the process of temperature acquisition, the current vacuum thermal test method of domestic satellites is mainly carried out through the method of thermocouple 110, generally by ...

Claims

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Application Information

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IPC IPC(8): G01K7/00B64G7/00
Inventor 常亮金其海王永诸成
Owner SHANGHAI ENG CENT FOR MICROSATELLITES
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