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Heat-dissipation device combined structure

A combination structure and heat dissipation device technology, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve the problems of inconvenient disassembly, failure to meet the buckling pressure requirements, and narrow versatility

Active Publication Date: 2014-10-01
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1. It is very inconvenient to disassemble;
[0008] 2. Narrow versatility;
[0009] 3. Unable to meet various fastening pressure requirements

Method used

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  • Heat-dissipation device combined structure
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  • Heat-dissipation device combined structure

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Embodiment Construction

[0040] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

[0041] see Figure 2A , Figure 2B , is the three-dimensional exploded view and the three-dimensional assembly view of the first embodiment of the combined structure of the heat sink of the present invention. As shown in the figure, a combined structure of the heat sink is provided with a substrate 20 and a heating unit 21 is installed on one side. The combined structure of the device includes a heat dissipation unit 22, at least one fastener 23 and at least one fixing member 24. The heat dissipation unit 22 is attached to the other side of the heating unit 21 opposite to the substrate 20, and the peripheral side of the heat dissipation unit 22 faces outward. At least one buckle section 221 is extended, wherein the cooling unit 22 is any one of a radiator or a cooling fin group;

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PUM

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Abstract

In a heat-dissipation device combined structure, a substrate is provided and a heating unit is arranged at one side of the substrate by sticking. The structure comprises a heat dissipation unit, at least one fastener and at least one fixing element, wherein the heat dissipation unit is arranged at the other side, opposite to the substrate, of the heating unit, at least one buckling segment is arranged at the peripheral side of the heat dissipation heat in an outward extension manner, the fastener is fixedly arranged on the substrate and provided with at least one opening hole and at least one hole, the buckling segment is correspondingly clamped in the opening hole, the fixing element is sleeved with an elastic element and correspondingly passes through the hole. By the design of the heat-dissipation device combined structure, convenience in disassembly and assembly can be improved, and effects of various bucking pressure demands are satisfied.

Description

technical field [0001] The invention relates to a combined structure of a heat sink, especially a combined structure of a heat sink that can increase the convenience of disassembly and assembly, and can meet various fastening pressure requirements. Background technique [0002] By the way, the computer currently used has a microprocessor on the circuit board inside, due to the proximity of technology and the needs of use. As a result, its calculation speed tends to be faster and faster. In contrast, in order to provide high-speed calculation functions, the microprocessor must generate high heat. At this time, it must be dissipated quickly through the heat sink and the fan installed to achieve normal operation. , otherwise it will damage the microprocessor or affect its original performance. [0003] Please refer to FIG. 1A and FIG. 1B, which are three-dimensional exploded views of the combined structure of the known heat dissipation device. A heat dissipation unit 11 is mou...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/40
Inventor 林源亿
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD