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Die bonding jig for light emitting diode

A technology of light-emitting diodes and fixtures, applied in the direction of light source fixation, light source, point light source, etc., can solve the problems of low efficiency, unable to meet the requirements of mass production, and time-consuming, and achieve the effect of high production efficiency

Active Publication Date: 2014-10-29
CHERY AUTOMOBILE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current die-bonding fixtures are basically manual, and the circuit boards to be bonded are frequently manually installed in the die-bonding fixture. Although the cost is low, it takes a long time and is inefficient. It is only suitable for small batch trial production. Unable to meet mass production requirements

Method used

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  • Die bonding jig for light emitting diode
  • Die bonding jig for light emitting diode
  • Die bonding jig for light emitting diode

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Embodiment Construction

[0023] In order to make the objectives, technical solutions and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0024] See figure 1 The embodiment of the present invention provides a light-emitting diode die-bonding jig 100, which is used in a light-emitting diode die-bonding machine. The LED die bonding fixture 100 includes a fixture main body 10, a first driver 20, a second driver 30, a positioning plate 40, a circuit board 50 and a pressing plate 60.

[0025] The jig body 10 and the pressing plate 60 constitute a cavity. The first driver 20, the second driver 30, the positioning plate 40 and the circuit board 50 are all contained in the cavity. The second driving machine 30 is used to push and open the pressing plate 60. The first driving machine 20 is used to push out the positioning plate 40 contained in the cavity, thereby facilitating the replace...

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PUM

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Abstract

The invention discloses a die bonding jig for a light emitting diode. The die bonding jig comprises a jig body, a first driver, a second driver, a locating plate, a circuit board and a press plate; the jig body and the press plate form a cavity, and the press plate is opened with array holes; the first driver, the second driver, the locating plate and the circuit board are held in the cavity; the locating plate is connected with the jig body in a sliding mode, and the first driver drives the locating plate to slide along a first direction so as to push out the locating plate; the circuit board is fixed at the locating plate; the second driver drives the press plate to move along a second direction so as to open the cavity, and the second direction is vertical to the first direction. The die bonding jig for the light emitting diode is high in production efficiency and suitable for mass production. The die bonding jig is suitable for different thicknesses of circuit boards so that different user requirements can be satisfied. The die bonding jig for the light emitting diode has advantages of easiness in operation, reliable locating, high production efficiency and convenience in mounting and maintaining.

Description

Technical field [0001] The invention relates to the field of automobile light-emitting diode manufacturing, in particular to a die-bonding jig for light-emitting diodes. Background technique [0002] LED light sources are widely used in various fields, such as automobile manufacturing, due to their small size, long life and energy saving advantages. Therefore, the demand for light-emitting diodes has increased significantly. Currently, a method of fixedly connecting multiple LED arrays to a circuit board is usually used to drive the LEDs to emit light. [0003] The process of fixing the LED on the circuit board is called die bonding. The current die-bonding fixtures are basically manual. Frequent manual installation of the circuit boards to be die-bonded into the die-bonding fixture is low cost, but it takes a long time and is inefficient. It is only suitable for small batch trial production. Unable to meet mass production requirements. Summary of the invention [0004] In order...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/67
CPCF21V19/0025F21V19/002F21Y2101/00
Inventor 张志辉何志宇孙永
Owner CHERY AUTOMOBILE CO LTD