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Curable resin composition

A curable resin and composition technology, applied in the direction of non-polymer organic compound adhesives, adhesive types, conjugated diene adhesives, etc., can solve LCD cracking, LCD display unevenness, adhesive surface Peeling and other problems, to achieve the effect of excellent adhesive force

Active Publication Date: 2016-11-09
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When this deformation is suppressed using a conventional adhesive (for example, Patent Document 1), there are problems such as peeling of the adhesive surface, cracking of the LCD, or uneven display of the LCD.

Method used

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  • Curable resin composition
  • Curable resin composition
  • Curable resin composition

Examples

Experimental program
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Effect test

experiment example

[0074] Unless otherwise stated, it is equivalent to carrying out the experiment at 23°C. The curable resin composition of the composition shown in Tables 1-2 was prepared and evaluated. The results are shown in Tables 1-2.

[0075] As each component in the curable resin composition described in the experiment example, the following compounds were selected.

[0076] As the oligomer having a (meth)acryloyl group and having a diene or hydrogenated diene skeleton as the component (A), the following compounds are selected.

[0077] (A-1): 1,2-polybutadiene oligomer ("TE-2000" manufactured by Nippon Soda Co., Ltd.) (Number average molecular weight in terms of polystyrene by GPC: 2000)

[0078] (A-2): Isoprene oligomer ("UC-203" manufactured by Kuraray Co., Ltd.) (number average molecular weight of 36,000 in terms of polystyrene by GPC, maleic anhydride addition of isoprene polymer product and 2-hydroxyethyl (meth)acrylate oligomer, Y in formula (1) is ethylene, R is methyl)

[0...

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Abstract

The present invention solves the problem that it is difficult to impart sufficient adhesiveness. The curable resin composition of the present invention contains the following (A) to (D) components, (A) 100 parts by mass of oligomerized (B) more than 400 parts by mass of oligomers that do not have (meth)acryloyl groups and have a diene or hydrogenated diene skeleton; (C) more than 100 parts by mass of oligomers with an aromatic ring (meth)acrylate; and (D) a photopolymerization initiator. In addition, a silane coupling agent may be contained, and it may be used as an adhesive composition.

Description

technical field [0001] The present invention relates to curable resin compositions. Background technique [0002] There are a resistive film type, a capacitance type, an electromagnetic induction type, an optical type, etc. about the touch panel mounted on the display apparatus, such as LCD (liquid crystal display). On the surface of these touch panels, a decorative plate for improving design or a label for designating a touch position may be adhered. Capacitive touch panels have a structure in which transparent electrodes are formed on a transparent substrate and a transparent plate is bonded thereon. [0003] Conventionally, the above-mentioned decorative board and touch panel, the above-mentioned label and touch panel, and the above-mentioned transparent substrate and transparent plate have been bonded together using an adhesive. Patent Document 1 describes a photocurable resin composition containing: (A) a polyisoprene (polyisoprene), polybutadiene (polybutadiene) or p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F290/00C08C19/00C09J4/02C09J109/00
CPCC09J4/00C08C19/00C08F290/048
Inventor 比舍佑基后藤庆次依田公彦
Owner DENKA CO LTD
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