Thin film sensor array and its preparation method

Abstract

The invention discloses a thin-film sensor array, which is characterized in that it is composed of several concentric ring-shaped thin-film sensors, and the formed thin-film sensor array covers the entire monitoring area. The structure, from bottom to top, is: an insulating support layer, a conductive sensing layer and a packaging protection layer, wherein the insulating supporting layer is formed on the surface of the substrate and is integrated with the substrate, and the conductive sensing layer is ring-shaped. The invention is beneficial in that it can more accurately monitor the potential of the thin film sensor array integrated with the metal structure during the crack initiation and propagation stages, and realizes the quantitative and real-time monitoring of the whole process of structural fatigue crack propagation; it is easy to communicate with The metal structure realizes integrated design and integration, which can be widely used in real-time monitoring of typical metal structures; it has high sensitivity, adjustable monitoring accuracy, wide monitoring range, low power consumption, no need for signal conversion, and high overall cost-effectiveness.

Description

technical field [0001] The invention relates to a thin-film sensor array and a preparation method thereof, in particular to a thin-film sensor array for quantitative monitoring of fatigue cracks of metal structural parts and a preparation method thereof, belonging to the technical field of metal structure health monitoring. Background technique [0002] In 1979, the US National Aeronautics and Space Administration (NASA) started a Fiber Optic Smart Structures and Skins (Fiber Optic Smart Structures and Skins) program, which for the first time embedded fiber optic sensors in advanced polymer composite skins for Monitor composite material strain and temperature. The main content is to embed various optical fiber sensors and signal processors in the skin of the structural components of aircraft and other space vehicles, and connect the optical fiber sensors and signal processors to the computer through the embedded optical fiber link, so as to endow the aircraft structural part...

AI Technical Summary

Problems solved by technology

[0004] The Chinese patent "A Micron Sensing Element and Its Preparation Method and Application" (patent number: ZL200910248773.0, publication date: 2011.06.29) proposes a simple design concept of a micron sensing element and its preparation method, and verified However, the micron sensing element failed to realize the quantitative monitoring of structural fatigue cracks.

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