Thin film sensor array and preparation method thereof

A thin-film sensor and array technology, which is applied in the field of thin-film sensor arrays and its preparation, can solve the problems of micron sensor elements failing to realize quantitative monitoring of structural fatigue cracks, and achieve excellent damage consistency, no need for signal conversion, and a wide monitoring range Effect

Active Publication Date: 2014-11-26
AIR FORCE UNIV PLA
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Problems solved by technology

[0004] The Chinese patent "A Micron Sensing Element and Its Preparation Method and Application" (patent number: ZL200910248773.0, publication date: 2011.06.29) proposes a simple design concept of a micron sensing element and its preparation method, and verified However, the micron sensing element failed to realize the quantitative monitoring of structural fatigue cracks.

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  • Thin film sensor array and preparation method thereof
  • Thin film sensor array and preparation method thereof
  • Thin film sensor array and preparation method thereof

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Embodiment Construction

[0039] The present invention will be specifically introduced below in conjunction with the accompanying drawings and specific embodiments.

[0040] refer to figure 1 , the film sensor array of the present invention is composed of several concentric annular film sensors, lead points are also formed on the film sensors, and the arrangement of the lead points is based on the principle of convenient wiring. The composed thin film sensor array covers the whole monitoring area (that is, the metal structure fatigue dangerous part).

[0041] The composition of the annular thin film sensor is described below.

[0042] refer to figure 2 , the annular thin film sensor mainly includes a three-layer structure, from bottom to top: an insulating support layer 1 made of an insulating support material, a conductive sensing layer 2 made of a conductive sensing material, and an encapsulation protection material Prepared encapsulation protection layer 3, insulating support layer 1 is preferab...

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Abstract

The invention discloses a thin film sensor array, which is characterized by comprising a plurality of concentric annular thin film sensors, wherein an entire monitoring area is covered by the formed thin film sensor array; each annular thin film sensor mainly comprises three layers of structures which are micron thick, i.e., an insulating supporting layer, a conductive sensing layer and an encapsulated protective layer from bottom to top, wherein the insulating supporting layer is formed on the surface of a substrate and is integrated with the substrate; the conductive sensing layer is of an annular structure. The thin film sensor array disclosed by the invention has the beneficial effects that potential monitoring is carried out on the thin film sensor array which is integrated with a metal structure accurately in crack initiation and expansion stages, thus realizing quantitative and real-time monitoring on a full process of structure fatigue crack expansion; the thin film sensor array easily realizes integrated design and integration with the metal structure and is widely applicable to real-time monitoring of typical metal structure. The thin film sensor array is high in sensitivity, adjustable in monitoring precision, wide in monitoring range, low in power consumption, free from signal conversion and high in comprehensive cost effectiveness.

Description

technical field [0001] The invention relates to a thin-film sensor array and a preparation method thereof, in particular to a thin-film sensor array for quantitative monitoring of fatigue cracks of metal structural parts and a preparation method thereof, belonging to the technical field of metal structure health monitoring. Background technique [0002] In 1979, the US National Aeronautics and Space Administration (NASA) started a Fiber Optic Smart Structures and Skins (Fiber Optic Smart Structures and Skins) program, which for the first time embedded fiber optic sensors in advanced polymer composite skins for Monitor composite material strain and temperature. The main content is to embed various optical fiber sensors and signal processors in the skin of the structural components of aircraft and other space vehicles, and connect the optical fiber sensors and signal processors to the computer through the embedded optical fiber link, so as to endow the aircraft structural part...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/60
Inventor 何宇廷侯波崔荣洪安涛伍黎明杜金强
Owner AIR FORCE UNIV PLA
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