Vibration fatigue life predication method and system for micro-packaging assembly

Abstract

The invention provides a vibration fatigue life predication method and system for a micro-packaging assembly. The method comprises the following steps: creating a vibration simulating finite element model according to the structures of the micro-packaging assembly and a fixing part; extracting the verification characteristics parameters; modifying the vibration simulating finite element model according to the verification characteristics parameters and the experimental characteristics parameters of the micro-packaging assembly to obtain a vibration simulating model; performing random vibration stress response simulation analysis for the micro-packaging assembly according to the vibration simulation model to obtain a dangerous vibration fatigue point; extracting equivalent stress power spectrum density of the dangerous vibration fatigue point under the random vibration load; converting the equivalent stress power spectrum density to obtain cyclic stress time domain data; calculating the vibration fatigue life of the dangerous vibration fatigue point under the random vibration load according to an S-N curve and the cyclic stress time domain data of the dangerous vibration fatigue point; predicating the vibration fatigue life of the micro-packaging assembly by the method of synchronously extracting the response data of the fixing part and the micro-packaging assembly. With the adoption of the method and system, the testing accuracy is improved.

Description

technical field [0001] The invention relates to the technical field of life prediction of electronic devices, in particular to a method and system for prediction of vibration fatigue life of micro-assembled components. Background technique [0002] With the development of science and social progress, the requirements for the integration of electronic products are getting higher and higher. Micro-assembly components refer to high-density integrated functional devices that encapsulate electronic components with metal and other materials, which can protect the electronic components in them from atmospheric water vapor corrosion. [0003] Since micro-assembly components usually need to be installed on fixtures such as PCB (Printed Circuit Board, printed circuit board) boards in practical applications, and the fixtures are non-rigid materials and large in size, micro-assembly may be caused by resonance of the fixtures. The synchronous resonance of components causes material fati...

AI Technical Summary

Problems solved by technology

[0004] Due to the vibration fatigue life prediction of the component BGA solder joints on the PCB, only the stress exerted by the resonance deformation of the PCB on the BGA solder joints of the plastic packaged components needs to be considered. lifespan, has the disadvantage of low accuracy, and is not suitable for testing micro-assembled components

Images