Method and system for predicting vibration fatigue life of micro-assembled components

Abstract

A method and system for predicting the vibration fatigue life of a micro-assembled component. According to the structure of the micro-assembled component and the fixed part, a vibration simulation finite element model is established and its verification characteristic parameters are extracted. The vibration simulation model is obtained by modifying the finite element model of vibration simulation according to the verification characteristic parameters and the experimental characteristic parameters of the micro-assembled components. According to the vibration simulation model, the random vibration stress response simulation analysis of the micro-assembled components is carried out, and the vibration fatigue risk points are obtained. Extract the equivalent stress power spectral density of vibration fatigue hazard points under random vibration loads. The cyclic stress time-domain data is obtained by transforming the equivalent stress power spectral density. The vibration fatigue life of the vibration fatigue risk point under random vibration load was calculated according to the S‑N curve of the vibration fatigue risk point and the cyclic stress time domain data. The method of synchronously extracting response data from the fixed parts and the micro-assembled components is used to predict the vibration fatigue life of the micro-assembled components, which improves the test accuracy.

Description

technical field [0001] The invention relates to the technical field of life prediction of electronic devices, in particular to a method and system for prediction of vibration fatigue life of micro-assembled components. Background technique [0002] With the development of science and social progress, the requirements for the integration of electronic products are getting higher and higher. Micro-assembly components refer to high-density integrated functional devices that encapsulate electronic components with metal and other materials, which can protect the electronic components in them from atmospheric water vapor corrosion. [0003] Since micro-assembly components usually need to be installed on fixtures such as PCB (Printed Circuit Board, printed circuit board) boards in practical applications, and the fixtures are non-rigid materials and large in size, micro-assembly may be caused by resonance of the fixtures. The synchronous resonance of components causes material fati...

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Problems solved by technology

[0004] Due to the vibration fatigue life prediction of the component BGA solder joints on the PCB, only the stress exerted by the resonance deformation of the PCB on the BGA solder joints of the plastic packaged components needs to be considered. lifespan, has the disadvantage of low accuracy, and is not suitable for testing micro-assembled components

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