A kind of SICP/CU composite material reinforced by low temperature glass phase and preparation method thereof

Abstract

The invention discloses a low temperature glass phase enhanced SiCp / Cu composite material and a preparation method thereof, and belongs to the technical field of ceramic enhanced metal-based composite material preparation. SiC particles coated by a glass phase are dispersed in Cu matrix of the SiCp / Cu composite material; and the glass phase comprises SiO2 and K2O, wherein a molar ratio of SiO2 to K2O is 2-6 and a volume ratio of SiC to SiO2 and Cu in the glass phase is 1:(0.2-1.2):(2-4). On one hand, the low temperature glass phase has good interface wettability with the SiC particles in melting, a certain amount of Cu2O is formed on the Cu-based particle surfaces during a sintering process of the composite material, and Cu2O participates in formation of interface glass phase, so that the Cu matrix has good adhesion with the glass phase. On the other hand, the introduction of the interface glass phase can prevent direct surface contact of a plurality of SiC particles in aggregation and prevent mutual diffusion of reactant atoms in an interface solid-phase reaction, thereby effectively inhibiting formation of interface solid-phase reaction products and enabling the composite material to gain excellent comprehensive mechanical properties.

Description

technical field [0001] The invention specifically relates to a SiC reinforced by a low-temperature glass phase p / Cu composite material, and the preparation method of the composite material, belong to the technical field of ceramic reinforced metal matrix composite material preparation. Background technique [0002] Silicon carbide particle-reinforced copper-based composite material combines the respective advantages of copper matrix and silicon carbide-reinforced particles, synergistically complements each other, combines excellent electrical conductivity, thermal conductivity, and wear resistance, and has the advantages of low raw material cost and simple preparation process. SiC p / Cu composite material is likely to become a new generation of high-performance materials with integrated structure and function, and play an important role in aerospace, electronic packaging and other fields. It is a new type of material with broad application prospects. However, due to the d...

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Problems solved by technology

However, due to the difference in the lattice types of SiC and Cu, there are a series of problems such as non-wetting and poor dispersion uniformity between the molten Cu and SiC phases, and interfacial reactions are prone to occur during the sintering process of the composite material, which seriously affects the SiC p Improvement of Comprehensive Properties of / Cu Composite Materials

At present, there are a large number of literature studies on the interface modification of ceramic-metal composites to improve the interface bonding and dispersion uniformity of the silicon carbide particle reinforcement phase and the metal matrix, but the overall performance improvement is relatively limited

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