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Full-automatic quantitative glue dispensing mechanism

A dispensing mechanism and fully automatic technology, applied in the direction of coating, liquid coating device on the surface, etc., can solve the problems of affecting the yield, high labor intensity, large operation error, etc., and achieve accurate dispensing position and firm fixation , the effect of improving the accuracy

Active Publication Date: 2015-01-28
BOZHON PRECISION IND TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, it is all manual operation, and the control of the dispensing position and the amount of glue is not accurate, which also affects the yield
At the same time, manual operation has large errors, low efficiency and high labor intensity

Method used

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  • Full-automatic quantitative glue dispensing mechanism
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  • Full-automatic quantitative glue dispensing mechanism

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] Examples, see attached Figure 1-9 , a fully automatic quantitative dispensing mechanism, which includes a base plate 1, an X-axis mechanism I, a Y-axis mechanism II, a Z-axis mechanism III, an XY connecting plate 2, a mounting plate 3, a Z-axis mounting connecting plate 4 and a Z-axis mounting plate 5. The X-axis mechanism is installed on the bottom plate; the Y-axis mechanism is installed on the X-axis mechanism through the XY connection plate; the installation plate is installed on the Y-axis mechanism; the Z-axis installation connection plate has two pieces, They are respectively installed vertically on both sides of the mounting plate; the Z-axis mounting plate is mounted on two Z-axis mounting connecting plates.

[0032] The X-axis mechanism includes an X-axis linear module 6, an X-axis photoelectric sensor 7, an X-axis mounting bar a8, an X-axis mounting bar b9, an X-axis sensing piece 10, an X-axis connecting block 11, an X-axis coupling 12, X-axis motor 13, X-...

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Abstract

The invention relates to a full-automatic quantitative glue dispensing mechanism. An X-axis mechanism is mounted on a base plate. A Y-axis mechanism is mounted on the X-axis mechanism through an XY connecting plate. A mounting plate is mounted on the Y-axis mechanism. The number of Z-axis installation connecting plates is two. The two Z-axis installation connecting plates are mounted on the two sides of the mounting plate respectively. A Z-axis mounting plate is mounted on the two Z-axis installation connecting plates. A Z-axis mechanism is mounted on the Z-axis mounting plate. A glue dispensing mechanism body is mounted on the Z-axis mechanism. A glue dispensing pressurization mechanism is mounted on the mounting plate and located on the rear side of the mounting plate. A CCD mechanism is mounted on the Z-axis mounting plate. A laser mechanism is mounted on a CCD mounting plate of the CCD mechanism. According to the full-automatic quantitative glue dispensing mechanism, the X-axis mechanism, the Y-axis mechanism and the Z-axis mechanism are used for transporting the glue dispensing mechanism body to a standard operation position; the glue dispensing pressurization mechanism is used for adjusting appropriate glue dispensing pressure to ensure an appropriate glue output amount; the CCD mechanism is used for calibrating the glue dispensing position; the laser mechanism is used for collecting the volume of glue and calculating the glue output amount. The full-automatic quantitative glue dispensing mechanism can accurately control the glue dispensing position and the glue dispensing amount and improve the accuracy of the glue dispensing process.

Description

Technical field: [0001] The invention relates to the field of dispensing mechanism equipment, and more specifically relates to a fully automatic quantitative dispensing mechanism. Background technique: [0002] In the process of PCB board manufacturing, dispensing will be applied in many places. When dispensing glue, it is necessary to move the dispensing needle to the standard operating position through the X-axis mechanism, Y-axis mechanism, and Z-axis mechanism; The glue in the glue valve is pressurized; at the same time, it is necessary to precisely control the dispensing position and the amount of glue to ensure the accuracy of the dispensing process. In the prior art, it is all manual operation, and the control of the dispensing position and the amount of glue is not accurate, which also affects the yield. At the same time, manual operation has large errors, low efficiency and high labor intensity. At this point, a fully automatic quantitative dispensing mechanism f...

Claims

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Application Information

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IPC IPC(8): B05C5/02B05C11/10
CPCB05C5/02B05C11/10
Inventor 吕绍林马金勇孙卫东赵永存刘治渊唐国成
Owner BOZHON PRECISION IND TECH CO LTD
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