Purification device of PCB (printed circuit board) etching liquid medicine

Abstract

The invention discloses a purification device of a PCB (printed circuit board) etching liquid medicine. The purification device comprises an etching groove, a liquid medicine tank for containing an OSP (organic solderability preservatives) antioxidant and a sprayer nozzle assembly, wherein the liquid medicine tank is positioned and placed at the periphery of the etching tank and is communicated with the etching tank by virtue of the sprayer nozzle assembly; a reflux outlet and a reflux inlet are positioned and formed on the liquid medicine tank and are communicated by virtue of a circulating pipeline, and the circulating pipeline is further provided with a circulating pump device; in addition, a filter dreg screen is positioned and arranged at the reflux outlet and a purification piece for breaking foam and adsorbing oil stains are positioned and formed at the reflux inlet, so that not only can air bubbles generated by circulating the OSP antioxidant liquid medicine be broken, but also the air bubbles can be decomposed to suspended oil stains which are adsorbed, thereby effectively reducing the oil stains carried when the OSP antioxidant liquid medicine is circulated, preventing the surface of the PCB from being polluted and improving the yield of the PCBs.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, and specifically provides a purification device for printing circuit board etching liquid. Background technique [0002] In the later stage of printed circuit board production, the pads on the formed board surface are easily oxidized, resulting in poor tin on the pads, failure to form firm solder joints, virtual soldering, and insufficient solder. In order to solve this defect, a chemical process is usually used to make up for the existing printed circuit board manufacturing process. This chemical process is called the OSP organic protective film process: a solid organic film is formed on the bare copper surface. This film is used to protect the copper surface from further oxidation in the normal environment. Flux removal, can form a strong solder joint with molten tin in a very short time. [0003] However, during the film-forming process of the OSP organic protective film, bubb...

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Problems solved by technology

[0003] However, during the film-forming process of the OSP organic protective film, bubbles will be generated during the circulation of the OSP antioxidant potion, which will cause the potion to decompose into suspended oil, so that when the OSP antioxidant potion is sprayed on the surface of the PCB board, it will cause copper Discoloration of the surface is not conducive to product yield

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