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Chemical mechanical polishing liquid for polishing low dielectric material

A low-dielectric material and chemical-mechanical technology, applied in the direction of polishing compositions containing abrasives, can solve problems such as slow polishing speed

Inactive Publication Date: 2015-02-25
ANJI MICROELECTRONICS (SHANGHAI) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore the present invention needs to solve 3 problems simultaneously: 1)

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  • Chemical mechanical polishing liquid for polishing low dielectric material
  • Chemical mechanical polishing liquid for polishing low dielectric material
  • Chemical mechanical polishing liquid for polishing low dielectric material

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Abstract

The present invention provides a silane coupling agent-containing chemical mechanical polishing liquid for polishing a barrier layer containing a low dielectric (low-k) material. According to the present invention, with the chemical mechanical polishing liquid, the high concentration and the colloid stability of the chemical mechanical polishing liquid can be achieved, and the polishing rate of the low-k material can be increased.

Description

technical field [0001] The invention relates to a chemical mechanical polishing fluid containing silicon-containing organic compounds and used for polishing low dielectric materials. Background technique [0002] With the continuous development of semiconductor technology and the continuous increase of interconnection layers in large-scale integrated circuits, the planarization technology of conductive layers and insulating dielectric layers has become particularly critical. In the 1980s, the chemical mechanical polishing (CMP) technology pioneered by IBM is considered to be the most effective method for global planarization. [0003] Chemical Mechanical Polishing (CMP) consists of chemical action, mechanical action, and a combination of both. It usually consists of a grinding table with a polishing pad, and a grinding head for carrying chips. The grinding head holds the chip and presses the front side of the chip against the polishing pad. When chemical mechanical polish...

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Application Information

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IPC IPC(8): C09G1/02
CPCC09G1/02
Inventor 周文婷王晨高嫄何华锋
Owner ANJI MICROELECTRONICS (SHANGHAI) CO LTD