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Epoxy resin composition, cured product thereof, and curable resin composition

A technology of curable resin and epoxy resin, applied in the field of curable resin composition, can solve problems such as reduced visibility, and achieve the effects of less birefringence, excellent heat resistance and high refractive index

Active Publication Date: 2017-03-15
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is known that various epoxy resin compositions are used as glass substitutes, but conventional epoxy resins have a large difference in refractive index from glass cloth or high birefringence In the case of diffuse reflection, etc., the visibility is reduced, making it difficult to use as LCD and deflected light

Method used

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  • Epoxy resin composition, cured product thereof, and curable resin composition
  • Epoxy resin composition, cured product thereof, and curable resin composition
  • Epoxy resin composition, cured product thereof, and curable resin composition

Examples

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Embodiment

[0196] Hereinafter, the present invention will be described in more detail through synthesis examples and examples. In addition, this invention is not limited to these synthesis examples and Examples. In addition, each physical property value in an Example was measured by the following method.

[0197] Various analysis methods used in Examples are described below.

[0198] Epoxy equivalent: According to JIS K 7236 (ISO 3001)

[0199] ICI Melt Viscosity: According to JIS K 7117-2 (ISO 3219)

[0200] Softening point: According to JIS K 7234

[0201] Total chlorine: According to JIS K 7243-3 (ISO 21672-3)

[0202] Chloride ion: According to JIS K 7243-1 (ISO 21672-1)

[0203] Sodium ions: determined by ion chromatography

[0204] Iron content: ICP spectroscopic analysis

[0205] Refractive index: According to ISO 5661

[0206] Gardner color number: according to ISO 4630-1

[0207] GPC:

[0208] Chromatographic column (Shodex KF-603, KF-602×2, KF-601×2)

[0209] Combine...

Synthetic example 1

[0214]The flask equipped with a stirrer, a reflux condenser, and a stirring device was first vacuumed, and after nitrogen replacement, while implementing a nitrogen purge (2L / hour), add a phenolic compound (DPPI1) (the substituent in the above formula (1) R is a compound of hydrogen atoms, SABIC PPPBP, the purity is more than 99%, the residual phenolphthalein is 200ppm, iron content <5ppm) 255 parts, epichlorohydrin 842 parts, methanol 168 parts, the water bath is heated to 75 ℃. When the internal temperature exceeded 65° C., after adding 21 parts of flaky sodium hydroxide in batches over 90 minutes, a post-reaction was further performed at 70° C. for 1 hour. After completion of the reaction, water washing was performed, and solvents such as excess epichlorohydrin were distilled off from the oil layer at 140° C. under reduced pressure using a rotary evaporator. To the residue, 200 parts of methyl isobutyl ketone was added and dissolved, and the temperature was raised to 70°C. ...

Synthetic example 2

[0216] In a 1L flask equipped with a stirrer, a reflux condenser, and a stirring device, while purging nitrogen (2L / hour), add a phenolic compound (DPPI1) (the substituent R in the above formula (1) is a hydrogen atom The compound, SABIC PPPBP, has a purity of more than 99%, residual phenolphthalein is 200ppm, iron content <5ppm) 255 parts, epichlorohydrin 601 parts, methanol 180 parts, and the water bath is heated to 75°C. After 1.5 hours (approximately 3 times the amount of nitrogen blown into the flask) after the start of the nitrogen purge, and further confirming that the internal temperature exceeded 65° C., 21 parts of flaky sodium hydroxide were added in batches over 90 minutes. Then, a post-reaction was further performed at 70° C. for 1 hour. After completion of the reaction, water washing was performed, and solvents such as excess epichlorohydrin were distilled off from the oil layer at 140° C. under reduced pressure using a rotary evaporator. To the residue, 200 par...

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PUM

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Abstract

A kind of epoxy resin composition, it contains the epoxy resin shown in following formula (2) and carboxylic acid and / or cationic polymerization catalyst, this epoxy resin is in Gardner colorimetric method (40%MEK solution) The color tone in is 2 or less; And, a kind of curable resin composition, it contains the epoxy resin shown in following formula (2) and phenol resin and / or polymerization catalyst (in the formula, the R of multiple existence is independently means a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms).

Description

technical field [0001] The present invention relates to an epoxy resin composition and a cured product thereof suitable for electrical and electronic material applications, particularly optical material applications. Furthermore, another aspect of the present invention relates to a curable resin composition suitable for electrical and electronic material applications requiring heat resistance and flame retardancy. Background technique [0002] In applications such as LED products and transparent substrate materials, epoxy resin compositions have been used from the viewpoint of a balance between performance and economy. In particular, epoxy resin compositions using bisphenol A epoxy resins excellent in heat resistance, transparency, and balance of mechanical properties are widely used (Patent Documents 1 to 3). [0003] As mentioned above, bisphenol A-type epoxy resins are versatile as optical resins, but these resins are usually liquid, and when they are made into sheets or...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/26
CPCC08G59/26C08G59/4215C08G59/681C08L63/00C08G2650/20
Inventor 中西政隆江原清二井上一真小渊香津美
Owner NIPPON KAYAKU CO LTD
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