thermal print head

A thermal printing head and printing direction technology, applied in printing and other directions, can solve the problems of weakened heat storage effect of the base layer, affect printing effect, and low printing density, and achieve the effect of increasing printing density, good printing effect, and increasing base temperature

CN104401135BActive Publication Date: 2016-11-23SHANDONG HUALING ELECTRONICS
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2016-11-23

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Abstract

The invention relates to a thermal printing head, in particular to a thermal printing head that a high-heat-conductivity interlayer is added into a base layer. The thermal printing head is characterized in that the high-heat-conductivity interlayer is added into the base layer of a thermal printing head base plate; the heat conductivity of the interlayer is greater than 20W / mK; an external lead is arranged in the interlayer. When the thermal printing head is required to be provided with a rapid heat dissipation property, the lead of the interlayer is connected with a base platform of the thermal printing head, so that the heat dissipation efficiency of the base layer is improved; when the thermal printing head is not required to be provided with the rapid heat dissipation property, the lead is suspended and is not connected, then the heat dissipation velocity of the thermal printing head depends on the heat conductivity of the base layer. The thermal printing head has the advantages that the heat dissipation effect is good, the switching is convenient, and high / low speed product switching requirements can be met.
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Description

technical field

[0001] The patent of the present invention relates to a thermal print head, especially a thermal print head with a high thermal conductivity interlayer added to the base layer. Background technique

[0002] As we all know, the thermal print head includes a substrate made of insulating material, a base layer is made on the substrate, and then wire electrodes are formed on the surface of the substrate and the base layer. The wire electrodes are divided into individual electrodes and common electrodes. One end of the individual electrode is connected to the heating resistor body belt along the secondary printing direction, and the other end is connected to the control IC. One end of the common electrode is connected to the heating resistor body belt along the secondary printing direction, and the other end is connected to the wire The electrical part of the thermal print head is composed of wire electrodes on the ceramic substrate, heating resistance band, contr...

Examples

Embodiment Construction

[0016] The present invention will be further described below in conjunction with accompanying drawing:

[0017] A thermal print head, including a substrate 8 made of insulating material, a base layer I3 is made on the base layer I3, and a layer of Al with a thermal conductivity exceeding 20W / mK is sintered on the base layer I3 by printing 2 o 3 The interlayer 4 is then the base layer Ⅱ 5, and then the wire electrodes are formed on the surface of the substrate 8 and the base layer 5. The wire electrodes are divided into individual electrodes and common electrodes. The edge formed on the wire electrodes is connected with the control IC. The secondary printing direction is connected with the heating resistor strip 6, and the other end is connected with the wire pattern. The electrical part of the thermal print head is composed of the wire electrode on the substrate 8, the heating resistor strip 6, the control IC and the PCB board 11. , the electrical part is integrally adhered ...