thermal print head

Abstract

The invention relates to a thermal printing head, in particular to a thermal printing head that a high-heat-conductivity interlayer is added into a base layer. The thermal printing head is characterized in that the high-heat-conductivity interlayer is added into the base layer of a thermal printing head base plate; the heat conductivity of the interlayer is greater than 20W / mK; an external lead is arranged in the interlayer. When the thermal printing head is required to be provided with a rapid heat dissipation property, the lead of the interlayer is connected with a base platform of the thermal printing head, so that the heat dissipation efficiency of the base layer is improved; when the thermal printing head is not required to be provided with the rapid heat dissipation property, the lead is suspended and is not connected, then the heat dissipation velocity of the thermal printing head depends on the heat conductivity of the base layer. The thermal printing head has the advantages that the heat dissipation effect is good, the switching is convenient, and high / low speed product switching requirements can be met.

Description

technical field [0001] The patent of the present invention relates to a thermal print head, especially a thermal print head with a high thermal conductivity interlayer added to the base layer. Background technique [0002] As we all know, the thermal print head includes a substrate made of insulating material, a base layer is made on the substrate, and then wire electrodes are formed on the surface of the substrate and the base layer. The wire electrodes are divided into individual electrodes and common electrodes. One end of the individual electrode is connected to the heating resistor body belt along the secondary printing direction, and the other end is connected to the control IC. One end of the common electrode is connected to the heating resistor body belt along the secondary printing direction, and the other end is connected to the wire The electrical part of the thermal print head is composed of wire electrodes on the ceramic substrate, heating resistance band, contr...

AI Technical Summary

Problems solved by technology

[0003] For the thermal print head, the base layer has the functions of heat dissipation and heat storage at the same time. There is a contradictory relationship between the two. The thermal conductivity of the base layer material generally does not exceed 5W / mK. If the size of the base layer is blindly reduced, although the heat dissipation rate of the thermal print head increases, the heat storage effect of the base layer is also weakened at the same time. So that in the normal printing process, when the same energy is applied, the temperature that can be reached on the surface of the thermal print head is reduced, resulting in low printing density and affecting the printing effect

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