Chip card device and method for manufacture thereof

A chip card and chip technology, which is applied in semiconductor/solid-state device manufacturing, recording carriers used by machines, instruments, etc., can solve the problems of SIM card packaging and logistics complexity, achieve material cost saving, prevent undesired use, prevent undesired effects of use

Inactive Publication Date: 2015-03-11
CARDPACK BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This makes the production of such SIM card packaging extremely complex from a logistical point of view

Method used

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  • Chip card device and method for manufacture thereof
  • Chip card device and method for manufacture thereof
  • Chip card device and method for manufacture thereof

Examples

Experimental program
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Embodiment Construction

[0046] figure 1 A diagram is shown of a chip card with SIM according to the prior art known, for example, as a carrier for removable SIM cards used in telephones. The known smart card comprises a carrier 2 on which a semiconductor substrate 4 in the form of a chip for the SIM 3 is arranged. The chip has memory and a microprocessor (neither shown in further detail). On the surface of the card, the chip is provided with contact surfaces. The chip 4 of the card 1 can thus be placed in contact with an external device so that the device can communicate with the data on the card. Such chips and their operation are known per se to the skilled person.

[0047] figure 2 A diagram of a smart card 1 according to the invention is shown. The chip card again comprises a carrier 8 , 9 on which a semiconductor substrate in the form of a chip for the SIM 3 is arranged. Here, however, the smart card 1 is divided by the fold line 6 into two card parts 8 , 9 , wherein the two card parts 8 ...

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PUM

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Abstract

The invention relates to a chip card device. This comprises a card-like carrier having received therein a semiconductor substrate in the form of a chip. The semiconductor substrate comprises at least a memory element and is provided with contact surfaces which are accessible on the surface of the card-like carrier to enable reading of the memory element therewith. The card-like carrier comprises a linear fold line configured for placing, on or close to a card part comprising the contact surfaces, a further card part situated on the side of the fold line remote from the card part.

Description

technical field [0001] The invention relates to a smart card arrangement according to the preamble of claim 1 . Such chip cards are commonly known as carriers for SIM (Subscriber Identity Module) cards used in telephones. Background technique [0002] Known chip cards comprise a semiconductor substrate in the form of a chip. This chip has memory and often also a microprocessor. On the surface of the card, the chip is provided with contact surfaces. The chip of the card can thus be brought into contact with an external device so that the device can communicate with the data on the card. This enables, for example, cash withdrawals or payments. [0003] A disadvantage of known smart card arrangements is generally that the chip and its contact surfaces are relatively susceptible to damage. In the event of a scratch, this could render the chip card unusable, which would cause great inconvenience to the user. [0004] According to the prior art, a known chip card device in t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/04G06K19/077
CPCG06K19/041G06K19/07726G06K19/07739H01L21/02
Inventor L·R·H·A·韦利森
Owner CARDPACK BV
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