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Wafer manufacturing scheduling method and scheduling system in semiconductor integrated circuit production

An integrated circuit and scheduling system technology, applied in the field of wafer manufacturing scheduling method and scheduling system in the production of semiconductor integrated circuits, can solve the problem that the subjective judgment of production managers has great influence, affects production efficiency, product date, and cannot effectively control product delivery. problems such as the urgency of the goods to achieve the effect of improving production efficiency

Active Publication Date: 2017-06-16
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the existing scheduling system that organizes production based on subjective consciousness of production management personnel cannot effectively control the delivery urgency of products on each production line, and production management personnel cannot complete the scheduling of products intuitively and easily
When scheduling products on the production line, the priority of the corresponding product can only be manually changed. The change time is random, and the final result is greatly affected by the subjective judgment of the production manager.
Due to the 24-hour continuous operation of the production line, the scheduling styles of the production management personnel of different shifts are different, which makes it very complicated and cumbersome to control the shipment progress of each product, affecting production efficiency and delivery date

Method used

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  • Wafer manufacturing scheduling method and scheduling system in semiconductor integrated circuit production

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Embodiment Construction

[0017] In order to further understand the technical content of the present invention, specific embodiments are given and described as follows in conjunction with the accompanying drawings.

[0018] see figure 1 The schematic diagram of the structure of the scheduling system in the production of semiconductor integrated circuits is shown, and the scheduling system in the production of semiconductor integrated circuits includes a product information unit 101, a time table unit 102, a product monitoring unit 103, and a priority calculation unit connected to the software and hardware of the application computer. Unit 104 , priority standard unit 105 , and display unit 106 .

[0019] The product information recording unit 101 is used to store relevant data of the process flow corresponding to different products, for example, including the number of stations that the product needs to pass through, the theoretical process time of each station, the number of layers required for photol...

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Abstract

The invention provides a wafer fabrication scheduling method and a wafer fabrication scheduling system for semiconductor integrated circuit production. The wafer fabrication scheduling system for semiconductor integrated circuit production comprises a product information unit, a schedule unit, a product monitoring unit, a priority calculation unit, a priority standard unit and a display unit, which are connected with the software and hardware of an application computer. According to the scheduling method, the priority of each product and batch is calculated according to the emergency degree of delivery to reflect the emergency degree of different products and batches more clearly and simply, and limited capacity resources in the production line are scheduled according to the priority from high to low. Therefore, the production target and efficiency are effectively controlled, and the production efficiency and the success rate of on-time delivery are improved.

Description

technical field [0001] The invention belongs to the intersection field of semiconductor integrated circuit manufacturing and information technology, and specifically relates to a wafer manufacturing scheduling method and a scheduling system in semiconductor integrated circuit production. Background technique [0002] Generally, the semiconductor integrated circuit manufacturing system is divided into four parts: wafer manufacturing (Wafer Fab, also called front-end process), wafer inspection (Wafer Probe), cutting and packaging, and final testing. Among them, wafer manufacturing refers to the processing of monocrystalline silicon wafers into integrated circuits, and its production line is the most core and complex manufacturing system in the entire semiconductor integrated circuit manufacturing. Due to different product types, process flows, and parameter requirements of different customers The same, so the scheduling management of wafer manufacturing is also quite difficult...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/418H01L21/67
CPCG05B19/41865Y02P90/02
Inventor 王冕
Owner SEMICON MFG INT (SHANGHAI) CORP
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