Flexible LED assemblies and LED light bulbs

A technology of light-emitting diodes and components, which is applied in the field of flexible light-emitting diode components, and can solve problems such as characteristic degradation and aging

Inactive Publication Date: 2015-03-18
EPISTAR CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If semiconductor products such as LED chips are exposed to the atmosphere for a long time, they will age due to the influence of water vapor or chemical substances in the environment, resulting in a decline in characteristics

Method used

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  • Flexible LED assemblies and LED light bulbs
  • Flexible LED assemblies and LED light bulbs
  • Flexible LED assemblies and LED light bulbs

Examples

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Embodiment Construction

[0035] figure 1 It is a three-dimensional schematic diagram of an LED assembly 100 according to an embodiment of the present invention and cut-away views in some positions. As shown in the figure, the LED assembly 100 is a flexible structure that can be rolled into a reel, which can be cut to an appropriate length as needed, and used as a lighting device (such as a light bulb) in which main light source. figure 1 Included are cross-sectional views A, B and C, respectively showing the cross-sectional views of the LED assembly 100 at three different positions.

[0036] The LED assembly 100 includes a flexible transparent substrate 106 . In one embodiment, the flexible transparent substrate 106 is made of non-conductive transparent material, such as glass or resin. The flexible transparent substrate 106 has surfaces 102 , 104 facing opposite directions and sidewalls 120 , 124 between the surfaces 102 , 104 . as figure 1 As shown, the flexible transparent substrate 106 is rou...

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PUM

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Abstract

Disclosure has LED assemblies and related LED light bulbs. An LED assembly comprises a flexible, transparent substrate, an LED chip on the first surface and electrically connected to two adjacent conductive sections, and a first wavelength conversion layer, formed on the first surface to substantially cover the LED chip. The flexible, transparent substrate comprises first and second surfaces opposite to each other, and several conductive sections, which are separately formed on the first surface.

Description

technical field [0001] The invention relates to a flexible light-emitting diode component, in particular to a light-emitting diode component that can be used for all-round lighting applications. Background technique [0002] At present, we can already see the application of various LED products in daily life, such as traffic signs, taillights, headlights, street lights, computer indicator lights, flashlights, LED backlights, etc. In addition to the necessary LED chip manufacturing process, these products must go through important packaging procedures. [0003] The main function of the LED package is to provide the necessary support for the electricity, light and heat of the LED chip. If semiconductor products such as LED chips are exposed to the atmosphere for a long time, they will age due to the influence of water vapor or chemical substances in the environment, resulting in a decline in characteristics. In LED packaging, epoxy resin is often used to wrap LED chips as an...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/62
CPCH01L33/58H01L25/0753H01L33/62F21V3/00H01L2924/0002F21K9/232F21Y2115/10F21Y2107/70F21Y2109/00H01L33/504H01L2924/00
Inventor 刘弘智郑子淇
Owner EPISTAR CORP
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