Wire harness bundling test plate and application method thereof

Abstract

The invention relates to a wire harness bundling test plate and an application method thereof. A cover plate is laid and fixedly mounted at the upper end of a metal base; a layer of wire harness bundling step map is clamped between the metal base and the cover plate; through holes are formed in the cover plate correspondingly; a wire harness positioning column and a wire harness clamp used for assisting wire harness positioning as well as a positive pole clamp and a negative pole clamp used for detecting the circuit are mounted in the through holes respectively; the positive pole clamp and the negative pole clamp are connected to a test circuit at the lower end of the metal base respectively; the test circuit is connected to an external power supply through conducting wires. According to the invention, the production efficiency of the wire harness bundling plate is improved; the material cost and the labor cost are reduced; wire harness bundling difficulty is greatly reduced; a testing function is added; bundling errors are reduced; the bundling efficiency and quality are effectively improved; the bundling specification is unified.

Description

technical field [0001] The invention belongs to the field of wire harness bundling of a general power conversion device, and relates to special tooling for making wire harnesses, in particular to a wire harness bundling test board and a method for using the same. Background technique [0002] At present, in the process of bundling and testing the wiring harness of the component connecting wires of the power conversion device, in the process of checking the on-off of the wiring harness according to the wiring structure of the device, there are mainly the following technical problems: 1. During the assembly process of the power conversion device Among them, the production and assembly of various components connecting wires and cables takes up more than half of the total assembly time, and the wiring of existing power conversion devices requires trained professionals to operate, which requires high technical requirements for personnel; 2 . Due to the different technical profici...

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Problems solved by technology

[0002] At present, in the process of bundling and testing the wiring harness of the component connecting wires of the power conversion device, in the process of checking the on-off of the wiring harness according to the wiring structure of the device, there are mainly the following technical problems: 1. During the assembly process of the power conversion device Among them, the production and assembly of various components connecting wires and cables takes up more than half of the total assembly time, and the wiring of existing power conversion devices requires trained professionals to operate, which requires high technical requirements for personnel; 2 . Due to the different technical proficiency of personnel, it is difficult to unify the specifications of the wire harnesses made by the existing wiring methods, which cannot meet the increasing demand for product consistency; 3. The existing tooling contains little information or the information is not intuitive. The technical requirements for workers are too high in production, which leads to increased production costs; 4. The specific operation of the binding process is cumbersome, and it is difficult for a single person to complete the operation independently, and it takes a long time; 5. The existing wiring tooling cannot match the actual wiring method of the device. The error is large; 6. The existing tooling cannot detect the continuity of the wiring harness, which leads to disassembly after the wiring is completed after being assembled on the device, which is inefficient

[0007] After comparative analysis, the problem to be solved in the first document is the error of the traditional binding method for the binding position and cutting size, and the technical means adopted by it are quite different from this patent application; the second and third documents The core technical problem to be solved in the technology in this patent application is different from that of this patent application, and the technical means used are also quite different from this patent application

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