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A double-sided deburring machine for electronic ceramic substrates

A technology of electronic ceramics and deburring machine, which is applied in the field of microelectronics, can solve the problems of uneven quality of finished substrates, easy contamination of substrates, incomplete cleaning, etc., achieve fast deburring speed, simple and compact structure, and reduce labor costs. intensity effect

Active Publication Date: 2017-03-15
都匀双成机械设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The present invention aims to provide a double-sided deburring machine for electronic ceramic substrates to solve the problems of slow speed, low efficiency and easy scratching of the existing electronic ceramic substrates when the burrs around the existing electronic ceramic substrates are manually removed. , Substrates are susceptible to contamination, incomplete cleaning, and the quality of finished substrates varies

Method used

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  • A double-sided deburring machine for electronic ceramic substrates
  • A double-sided deburring machine for electronic ceramic substrates
  • A double-sided deburring machine for electronic ceramic substrates

Examples

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Embodiment

[0043] During use, the substrate punched out from the stamping process falls on the feeding conveyor belt 311 in the automatic material receiving and conveying mechanism 3, the motor 301 drives the driving wheel 302 to rotate, and the driving wheel 302 drives the driven wheel 313 to rotate through the chain 303, Since the driving wheel 314 and the driven wheel 313 are coaxially arranged, the driven wheel 313 can drive the driving wheel 314 to rotate, and the driving wheel 314 can drive the feeding conveyor belt 311 to rotate, and the substrate can be removed from the feeding conveyor belt 311. The left end moves to the right end. When the substrate is transported to the pressing block 305, the pressing block 305 will press the substrate on the left side of the upper end of the conveyor belt 105 in the vacuum adsorption conveying system A1. The pressing of substrates with different thicknesses The height of the pressing block 305 and the pressing wheel 306 can be realized by adj...

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Abstract

The invention discloses a dual-surface de-burring machine for an electronic ceramic substrate. The dual-surface de-burring machine comprises a machine frame, wherein a vacuum absorption conveying system A and a vacuum absorption conveying system B with different heights are arranged on the top end of the machine frame; a plurality of burr cleaning mechanisms are also arranged at the top end of the machine frame, are uniformly distributed and are erected on the vacuum absorption conveying system A and the vacuum absorption conveying system B; the height of the vacuum absorption conveying system A is greater than that of the vacuum absorption conveying system B; an automatic material receiving conveying mechanism is arranged on the front part of the bottom end of the vacuum absorption conveying system A; a plurality of motor assemblies are arranged on the machine frame; an automatic turning mechanism is arranged at the tail end of the vacuum absorption conveying system B. The dual-surface de-burring machine has the advantages of simple structure, convenient operation, high cleaning speed, high cleaning cleanness, high automation degree, high efficiency and the like; manual cleaning by workers is not required; the phenomenon that the substrate is damaged is not caused; the labor intensity of the workers can be greatly reduced; the production efficiency can be improved; the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a double-sided deburring machine for electronic ceramic substrates. Background technique [0002] In the field of microelectronics, the main substrates of chip inductors, resistors, and capacitors are all sheet ceramics. These sheet ceramics are all made of alumina powder through casting, stripping, punching, and sintering. Cut into different sizes substrate. During the punching process, it is easy to form burrs around the substrate. If the burrs are not removed, the substrate will become a waste product. At present, the burrs on the edge of the substrate are generally cleaned manually. There is no electronic ceramic substrate on the market. dedicated deburring machine. Manual deburring has the following disadvantages: [0003] 1) The substrate is not allowed to have any impurities and stains before sintering, otherwise defects will be left on the substrate after sint...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B9/06B24B41/00
CPCB24B9/065B24B41/005
Inventor 陈光明岑刚杨芳
Owner 都匀双成机械设备有限公司