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Semiconductor package, encapsulation resin, encapsulant and method of making the same

A technology of encapsulating resin and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., and can solve problems such as chip failure and damage to the chip's electrical structure

Active Publication Date: 2017-08-29
ADVANCED SEMICON ENG INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The package usually produces a high concentration of chloride ions during the manufacturing process. Some of these chloride ions are combined with resins to form organic compounds, while other chloride ions are difficult to remove from the process and dissociate in the package. Finally, excessive or excessive chloride ions destroy the electrical structure of the chip, causing the chip to fail to work properly

Method used

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  • Semiconductor package, encapsulation resin, encapsulant and method of making the same
  • Semiconductor package, encapsulation resin, encapsulant and method of making the same
  • Semiconductor package, encapsulation resin, encapsulant and method of making the same

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Embodiment Construction

[0049] Please refer to figure 1 , which shows a cross-sectional view of a semiconductor package according to an embodiment of the present invention. The semiconductor package 100 includes a substrate 110 , a chip 120 , at least one bonding wire 130 and a sealant 140 .

[0050] The chip 120 is disposed on the substrate 110 with the active surface 120 u facing upwards, and is electrically connected to the substrate 110 through the bonding wire 130 . The encapsulant 140 is formed on the substrate 110 and covers the chip 120 and the bonding wire 130 . The chip 120 includes at least one pad 121 , and the material of the pad 121 combines with the material of the bonding wire 130 to form an intermetallic compound 150 . In one embodiment, the pads 121 are, for example, formed of aluminum or its alloys, and the bonding wires 130 are, for example, formed of copper. The composition of aluminum and copper is intermetallic compound 150 of copper aluminide (Cu9Al4). As shown in the form...

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Abstract

The invention relates to a semiconductor package piece, package resin, package adhesive and manufacturing methods of the package resin and the package adhesive. The semiconductor package piece comprises a substrate, a chip and the package adhesive. The chip is arranged on the substrate. The package adhesive is formed on the substrate and comprises the package resin and a coating body, and the chip is coated with the package adhesive. The package resin comprises package resin particles and chloride ions, wherein the chloride ions are dissociative in the package resin particles. The concentration of the chloride ions in the package resin is less than 8ppm, and the coating body is mixed with the package resin.

Description

technical field [0001] The present invention relates to a semiconductor package, its encapsulation resin and sealant, a method for manufacturing the encapsulation resin and a sealant, and in particular to a semiconductor package with low chloride ion concentration, its encapsulation resin and sealant. A method for manufacturing sealant and encapsulation resin, and a method for manufacturing sealant. Background technique [0002] A traditional semiconductor package includes a chip and a package, wherein the package covers the chip. The package usually produces a high concentration of chloride ions during the manufacturing process. Some of these chloride ions are combined with resins to form organic compounds, while other chloride ions are difficult to remove from the process and dissociate in the package. Finally, excessive or excessive chloride ions destroy the electrical structure of the chip, causing the chip to fail to work normally. Contents of the invention [0003]...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/29H01L21/56
CPCH01L2224/48091H01L2224/48463
Inventor 江姿幸陈银发杨秉丰林光隆
Owner ADVANCED SEMICON ENG INC
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