Die and Chip

Abstract

Various embodiments of the invention relate to dies and chips. A die according to an embodiment includes: contact pads configured to provide electrical contact to circuit elements included in the die; lateral edges proximate to the contact pads; and a cover layer including a protective structure, the protective structure includes at least one elongated structure, wherein the cover layer includes an opening providing access to the contact pad, so as to electrically couple the contact pad with an external contact, wherein the protective structure is arranged at the lateral edge and the contact pad between. By using embodiments, the risk of contamination to the top side of the die can be reduced during fabrication and packaging of the chip.

Description

technical field [0001] Various embodiments of the invention relate to dies and chips. Background technique [0002] Today, electronic and electrical devices, including integrated circuits (ICs), sensors, and other more complex devices, but also discrete electronic devices, are often implemented based on thin film and semiconductor or semiconductor-related technologies. Corresponding structures are typically formed on or integrated into a substrate material such as a semiconductor material. The fabrication process is typically performed at the wafer level, which is then diced into individual die. The die are then typically packaged to form a chip. [0003] In a package frame, the die is typically mounted to a carrier such as a lead frame. Typically, the die is mounted to the carrier using some form of adhesive including solder paste. [0004] Often, however, these adhesives include some form of flux or other components that tend to creep onto the top surface of the die. ...

AI Technical Summary

Problems solved by technology

Therefore, the risk of unwanted contamination of the contact pads tends to increase

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