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Modular integrated circuit packaging structure and manufacturing method thereof

An integrated circuit and packaging structure technology, which is applied to a module integrated circuit packaging structure with an electrical shielding function and the field of its manufacture, can solve the problems of difficulty in manufacturing an electromagnetic shielding metal cover, multiple man-hours, different size blocks and the like

Active Publication Date: 2017-10-17
纮华电子科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this kind of known electromagnetic shielding metal cover must be designed and manufactured according to different modules or devices, so that the known electromagnetic shielding metal cover needs to consume more man-hours, manpower and cost
[0006] In addition, another defect of the above-mentioned known electromagnetic shielding metal cover is that the size, shape, and block of the electronic circuit or device that needs to be used for electromagnetic shielding are different. If it is necessary to manufacture modules with different sizes, shapes, and blocks Manual moulds, stamping processing and step-by-step component packaging make the production of electromagnetic shielding metal covers difficult and cannot be applied to the production line of rapid production, which reduces the economic benefits and industrial utilization of known electromagnetic shielding metal covers.

Method used

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  • Modular integrated circuit packaging structure and manufacturing method thereof
  • Modular integrated circuit packaging structure and manufacturing method thereof
  • Modular integrated circuit packaging structure and manufacturing method thereof

Examples

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no. 1 example 〕

[0028] see Figure 1 to Figure 10 As shown, the first embodiment of the present invention provides a method for manufacturing a modular integrated circuit packaging structure Z with an electrical shielding function, which includes the following steps:

[0029] First, step S100 is: cooperate figure 1 , figure 2 and image 3 As shown, an initial substrate 1' is provided. The initial substrate 1' includes a plurality of substrate units 1 connected to each other and arranged in a matrix, wherein each substrate unit 1 includes a circuit substrate 10, and a The ground layer 11 completely covered by the substrate 10 (such as a sheet-shaped ground layer 11), and an inner conductive structure 13 disposed inside the circuit substrate 10 and electrically connected to the ground layer 11, wherein the inner conductive structure 13 includes a plurality of inner The conductive layers 130 (eg strip-shaped inner conductive layers 130 ), and each inner conductive layer 130 has a first end 1...

no. 2 example

[0041] see Figure 11 As shown, the second embodiment of the present invention can provide a modular integrated circuit packaging structure Z with electrical shielding function, which includes: a substrate unit 1 , an electronic unit 2 , a packaging unit 3 and a shielding unit 4 . Depend on Figure 11 and Figure 9 It can be seen from the comparison that the biggest difference between the second embodiment of the present invention and the first embodiment is that: in the second embodiment, the substrate unit 1 includes a circuit substrate 10 with an outer circumference 100 and a circuit substrate 10 arranged inside the circuit substrate 10 The ground layer 11, wherein the end of the ground layer 11 is directly exposed from the outer periphery 100 of the circuit substrate 10 (further, the end of the ground layer 11 is directly exposed by a plurality of first half-through holes 121), so the metal shielding layer 40 can directly contact the grounding layer 11 exposed from the o...

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Abstract

The invention discloses a module integrated circuit packaging structure and a fabricating method thereof. The module integrated circuit packaging structure comprises a substrate unit, an electronic unit, a packaging unit and a shielding unit, wherein the substrate unit comprises a circuit substrate and an earthing layer arranged inside the circuit substrate, and the earthing layer is exposed from the external surrounding periphery of the circuit substrate; the electronic unit comprises a plurality of electronic elements arranged on the circuit substrate; the plurality of electronic elements are electrically connected to the earthing layer through the circuit substrate; the packaging unit comprises a packaging colloid which is arranged on the circuit substrate and covers the plurality of electronic elements; the shielding unit comprises a metal shielding layer which is coated on the external surface of the packaging colloid and on the external surrounding periphery of the circuit board. The metal shielding layer is in direct contact with the earthing layer exposed from the external surrounding periphery of the circuit board, so that the plurality of electronic elements are directly electrically connected to the metal shielding layer through the earthing layer.

Description

technical field [0001] The invention relates to a module integrated circuit packaging structure and a manufacturing method thereof, in particular to a module integrated circuit packaging structure with an electrical shielding function and a manufacturing method thereof. Background technique [0002] In recent years, with the rapid development of science and technology, various products are oriented toward the application of technology, and are still in the process of continuous progress and development. In addition, due to more and more functions of products, most of the current products are designed in a modular way. However, the integration of multiple modules with different functions in the product can greatly increase the function of the product, but under the current demand for miniaturization and exquisite appearance of the product, how to design a product that is both small in size and multi-functional? Product is the goal that all walks of life are currently researc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/552
CPCH01L2924/15162H01L2924/3025
Inventor 简煌展
Owner 纮华电子科技(上海)有限公司