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Flat panel image sensor and manufacturing method thereof

A technology of image sensor and manufacturing method, which is applied in the direction of radiation control devices, etc., and can solve problems such as inconsistent lighting conditions, white spots, and unstable display of flat-panel image sensors

Active Publication Date: 2017-10-27
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Specifically, for the structure of the flat panel image sensor, the pixels will be affected by temperature and humidity from all directions, resulting in problems such as inconsistent lighting conditions, unstable display, and white spots in the flat panel image sensor.

Method used

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  • Flat panel image sensor and manufacturing method thereof
  • Flat panel image sensor and manufacturing method thereof
  • Flat panel image sensor and manufacturing method thereof

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Embodiment Construction

[0065] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals denote the same or similar structures in the drawings, and thus their repeated descriptions will be omitted.

[0066] The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the invention. However, those skilled in the art will appreciate that the technical solutions of the present invention may be practiced without one or more of the specific...

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Abstract

The invention provides a flat-panel image sensor and a manufacturing method thereof. The flat-panel image sensor includes: a substrate having a pixel area and a peripheral area on the substrate, the pixel area includes a sensing element, and the peripheral area includes at least one mask template alignment marks; a first protection layer formed on the sensing element in the pixel area and extending to at least one of the mask alignment marks in the peripheral area; an upper electrode layer formed on the On the first protection layer in the pixel area; an etch barrier layer formed on the first protection layer in the peripheral area; a second protection layer covering the upper electrode layer and the etch barrier layer; Wherein, in the peripheral region, the second protective layer includes a first opening exposing the etch barrier layer, and the first opening is in phase with at least one mask alignment mark. match. It can reduce the influence of the temperature and humidity in the first opening on the pixels in the pixel area.

Description

technical field [0001] The invention relates to the field of semiconductor devices, in particular to a flat panel image sensor and a manufacturing method thereof. Background technique [0002] Flat-panel image sensors, especially flat-panel X-ray image sensors, have been widely used and developed in fields such as medical imaging and industrial non-destructive detection. The flat-panel X-ray image sensor is a device that converts X-rays into electrical signals according to light intensity. After X-rays irradiate and penetrate the object, the light intensity changes through absorption, scattering, and divergence. The different light intensities in different regions indicate the differences in the internal structure of different regions of the irradiated object. The X-rays that penetrate the irradiated object are converted into corresponding electrical signals by the flat-panel X-ray suitcase sensor, and finally a grayscale image directly related to the internal structure of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146
Inventor 费小磊
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD