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Monitoring method and monitoring device for substrate processing

A monitoring device and substrate technology, applied in general control systems, program control, computer control, etc., can solve problems such as process accidents, time-consuming and labor-intensive, leakage friction or repeated friction, etc.

Inactive Publication Date: 2017-08-29
HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the production line breaks down, the substrate without friction treatment will also be put into the clamp, and automatically enter the next process, resulting in loss of materials and production, resulting in process accidents
If after the substrate is placed in the clamp, manual statistics are used to count the unrubbed substrates, not only time-consuming and labor-intensive, but also statistical errors may occur, resulting in missed friction or repeated friction.

Method used

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  • Monitoring method and monitoring device for substrate processing
  • Monitoring method and monitoring device for substrate processing

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Experimental program
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specific Embodiment approach

[0052] As a specific implementation manner of the present invention, the step S20 includes:

[0053] S21. Setting a status flag corresponding to the information of each process in the status information;

[0054] S22. Convert the information of each process in the state information of the detected substrate into a corresponding state mark;

[0055] S23. Comparing the state mark of the detected substrate with the state mark corresponding to the predetermined process, when the state mark of the detected substrate is consistent with the state mark corresponding to the predetermined process, the substrate is in the state of having completed the predetermined process ; When the status flag of the monitored substrate is inconsistent with the status flag corresponding to the predetermined process, the substrate is in the state of not completing the predetermined process.

[0056] After the information of each process in the state information is converted into a corresponding state mar...

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Abstract

The invention provides a monitoring method and device used for processing baseplates. The monitoring method comprises the following steps: (10) detecting the state information of each baseplate located at a detecting station, wherein the state information comprises the information of all processing procedures of the baseplates; (20) judging the state of the baseplates according to the state information of the baseplates; executing step (30) when the state information of the baseplates comprises predetermined procedure information; executing step (40) when the state information of the baseplates does not comprise predetermined procedure information; (30) controlling the baseplates to enter the procedure after the predetermined procedures; (4) suspending the processing of the baseplates which do not comprise the predetermined procedure information. The monitoring method can prevent the accident that the baseplates are scraped because the baseplates do not fulfill the predetermined procedures and directly enter the neat procedure, and saves manpower.

Description

technical field [0001] The invention is used in the field of manufacturing display devices, and in particular relates to a monitoring method and a monitoring device for substrate processing. Background technique [0002] In the manufacturing process of the display device, the processing of the substrate is usually carried out automatically on the production line: after the substrate after the friction treatment is put into the clip, when the system detects that each substrate is put into the clip, Control each substrate to automatically enter the next process. However, when a failure occurs on the production line, the substrate that has not been rubbed will also be put into the clamp, and will automatically enter the next process, resulting in loss of materials and labor, resulting in process accidents. If after the substrate is put into the clamp, manual statistics are used to count the substrates that have not been rubbed, which is not only time-consuming and labor-intens...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/048
CPCG05B19/4063
Inventor 姚成宜
Owner HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD