Unlock instant, AI-driven research and patent intelligence for your innovation.

Bus pressure test system and method thereof

A pressure test and bus technology, applied in error detection/correction, detection of faulty computer hardware, instruments, etc., can solve the problems of consuming CPU usage time and poor availability of stress tests, and achieve the effect of improving availability

Inactive Publication Date: 2015-06-03
INVENTEC PUDONG TECH CORPOARTION +1
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method still consumes CPU usage time, and it is also difficult to form a mesh cross-test model, so it still cannot effectively solve the problem of poor usability of stress testing
[0005] To sum up, it can be seen that there has been a problem of poor usability of stress testing in the existing technology for a long time, so it is necessary to propose improved technical means to solve this problem

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bus pressure test system and method thereof
  • Bus pressure test system and method thereof
  • Bus pressure test system and method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The implementation of the present invention will be described in detail below in conjunction with the drawings and examples, so that the realization process of how to use technical means to solve technical problems and achieve technical effects in the present invention can be fully understood and implemented accordingly.

[0030] Before explaining the bus pressure test system and method disclosed in the present invention, the test environment of the present invention will be described first. The present invention is applied in a fast peripheral interconnection standard (PCI Express, PCI-E) device for stress testing Before, the PCI-E device of the present invention needs to be installed in the bus environment with central processing unit, PCI-E interface and memory, and its installation mode is to insert the PCI-E device into the slot of the PCI-E interface. In actual implementation, assuming that there are two central processing units, and each central processing unit is...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A bus pressure testing system and method thereof are disclosed, where a peripheral component interconnect express (PCI-E) device is used to initialize a central processing unit (CPU), peripheral component interface express (PCI-E) device interface and memory according to a testing model, generate a data transmission path corresponding to the testing model, produce a pressure data stream by using the PCI-E device, and test a bus for its pressure by flowing the pressure data transmission stream on the data transmission path. As such, the pressure testing may be enhanced in practicability.

Description

technical field [0001] The present invention relates to a stress testing system and its method, in particular to a bus stress testing system and its method which uses a PCI-E standard device (PCI-E) to generate a stress data stream to avoid occupying the use time of a central processing unit. Background technique [0002] In recent years, with the vigorous development of semiconductor technology, the current development trend of the central processing unit (Central Processing Unit, CPU) is to integrate the external bus and memory controller inside the central processing unit, so that the central processing unit can directly communicate with the memory and fast Peripheral Interconnect Standard (PCI-E) device electrical connection. [0003] Generally speaking, the bus stress test between the above-mentioned central processing unit, memory and fast peripheral interconnection standard devices adopts the test model starting from the central processing unit, that is, through the c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/22
CPCG06F11/221
Inventor 张天超
Owner INVENTEC PUDONG TECH CORPOARTION