Unlock instant, AI-driven research and patent intelligence for your innovation.

Combined Power Supply and I/O System with Boost Capability

A technology of power supply and output system, applied in the direction of wired transmission system, distribution line transmission system, transmission system, etc., which can solve problems such as diode voltage drop cannot be overcome, long connection time, low baud rate, etc.

Active Publication Date: 2018-08-28
MICROCHIP TECH INC
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the diode-capacitor solution has proven to be disadvantageous in low voltage systems
More specifically, in such systems, the diode drop may be insurmountable
[0005] Resistor-capacitor solutions are disadvantageous due to baud rate and power consumption contention
That is, low power consumption requires large resistors that require longer on-times and lower baud rates that increase power consumption

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Combined Power Supply and I/O System with Boost Capability
  • Combined Power Supply and I/O System with Boost Capability
  • Combined Power Supply and I/O System with Boost Capability

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The invention and its various features and advantageous details are explained more fully with reference to the exemplary and therefore non-limiting embodiments illustrated in the drawings and detailed in the following description. Descriptions of well-known programming techniques, computer software, hardware, operating platforms and protocols may be omitted so as not to unnecessarily obscure the present invention in detail. It should be understood, however, that the detailed description and specific examples, while indicating preferred embodiments, are given by way of illustration only and not limitation. Various substitutions, modifications, additions and / or rearrangements within the spirit and / or scope of the basic inventive concept will become apparent to those skilled in the art from the present invention.

[0018] As used herein, the terms "comprises, comprising," "includes, including," "has, having," or any other variation thereof, are intended to encompass a non-...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A combined power and input / output system for an electronic device is disclosed, comprising: a host system; a target system operatively coupled to the host system via combined power and I / O lines; and the target A power boost circuit in the system that is used to enable higher voltage target devices.

Description

technical field [0001] The present invention relates to power and communication connections for electronic devices. In particular, the present invention relates to source voltage boosting with combined power and input / output lines. Background technique [0002] Small form factor is an increasingly important design consideration in the field of mobile devices, such as cellular phones and BlackBerry handsets. Such devices typically include a battery pack with power lines and input / output lines. However, in some instances, the small form factor of the battery pack makes it difficult to provide enough pins for communication. [0003] Accordingly, it is known to provide a combined power and input / output pin or pins on an integrated circuit or other device. Such solutions typically include diodes and capacitors or resistors and capacitors to extract power and store power for the device. [0004] However, the diode-capacitor solution has proven to be disadvantageous in low volt...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F13/42H04L12/40G06F1/26H04L12/10G05B19/042G06F13/40H04B3/54H02J7/00
CPCG06F13/4072G06F13/4291H04B3/542H04B3/548H04L12/10G06F13/4022G06F1/3246G06F1/3287H02J4/00H02J7/00H02M3/158
Inventor 约瑟夫·朱利谢彼得·席克维维安·德尔波特
Owner MICROCHIP TECH INC